Single-Camera Optical Inspection for Semiconductor Top and Side Views
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Solution Overview
Problem
Conventional side view inspection in semiconductor defect detection requires multiple cameras, leading to high costs and spatial requirements, complicating the inspection process and increasing complexity.
Innovation Solution
An optical inspection device utilizing a single camera with multiple optical paths, including a focus compensation prism and mirror, to achieve both side and top views, compensating for path length differences using prism thickness, height, and refractive index adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple cameras are used to achieve side view inspection, then inspection capability is improved, but system cost and spatial requirements increase
Solution Approach 1:
The patent combines multiple camera functions into a single camera by using beam splitting optics. The single camera captures both top view and side view images simultaneously through different optical paths, eliminating the need for multiple separate cameras and reducing system complexity while maintaining comprehensive inspection capability
Solution Approach 2:
The patent introduces optical path separation in the spatial dimension using beam splitters and mirrors. By creating distinct optical paths for top view and side view through different spatial dimensions, the system achieves multi-angle inspection with a single camera, resolving the contradiction between inspection capability and device complexity
2Adaptability or versatility
If multiple cameras are positioned at various angles, then side view inspection capability is improved, but spatial requirements increase
Solution Approach 1:
The patent merges multiple viewing angles into a single camera system using beam splitting optics. The optical design allows one camera to capture both top view and side view through different optical paths, dramatically reducing the spatial footprint compared to positioning multiple cameras at various angles
Solution Approach 2:
The patent uses optical path separation in spatial dimensions to achieve multi-angle views. By directing light from different angles through beam splitters and mirrors to a single camera, the system eliminates the need for large physical space required for multiple camera positions
3Measurement precision
If optical path lengths are made equal, then focus consistency is improved, but optical path design complexity increases
Solution Approach 1:
The patent introduces optical path length compensation elements as intermediaries in the optical system. These compensation elements adjust the optical path lengths of different viewing angles to be equal, ensuring focus consistency across top view and side view images without requiring complex redesign of the entire optical path
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables comprehensive and accurate semiconductor defect detection with reduced costs and space, enhancing efficiency and productivity by consolidating multiple views into a single image, facilitating defect identification and reducing software analysis time.
Implementation Method 1
a mirror provided in said first of said multiple optical paths for redirecting said first of said multiple optical paths to said semiconductor device to thereby obtain said first view of said semiconductor device
Implementation Method 2
a focus compensation prism provided in said first of said multiple optical paths and adapted for compensating for different lengths of said multiple optical paths
Data Source
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AI summary
An Optical Inspection device arranged for optically inspecting a semiconductor device, said Optical Inspection device comprising a camera, a lens mounted to said camera and configured for providing multiple optical paths towards said semiconductor device, a first of said multiple optical paths arranged for providing a first view of said semiconductor device, and a second of said multiple optical paths arranged for providing a second view, different to said first view, of said semiconductor device, a focus compensation prism provided in said first of said multiple optical paths and adapted for compensating for different lengths of said multiple optical paths, a mirror provided in said first of said multiple optical paths for redirecting said first of said multiple optical paths to said semiconductor device to thereby obtain said first view of said semiconductor device.