Optically Investigating Flaws/Contamination TRIZ Cases

Fixed washing times can leave high-concentration fluorescent samples inadequately cleaned; concentration-based control extends washing when needed.

A single camera combines top and side semiconductor views through separate optical paths, reducing camera count, space, and analysis time.

2D camera screening flags abnormal wafer electrode pads for targeted 3D measurement, improving needle-mark inspection speed and accuracy.

Planar surfaces can blur wafer-edge signals; non-planar reflectors reshape laser patterns for precise detection and process alignment.

Coherent-beam scanning identifies backside scattering patterns to separate frontside and backside defects on transparent substrates.

A tiltable, rotatable support and dual-direction illumination automate jet blade imaging for more reliable defect detection across complex geometries.

Two wavelengths illuminate separate points on a moving object, enabling focus-free oblique imaging and clearer reflectance or transmittance capture.

Distributed sensors capture and filter electromagnetic radiation from active dam cracks to locate and quantify internal defects in real time.

Different wavelengths and imaging devices detect detached particles and surface defects during rotating container inspection.

Comparing basic and inverted brightness patterns intensifies scattered-light defects without requiring a high-pixel-density projector.

Multiple cameras inspect several metal cans at once from different angles, covering side and bottom surfaces for faster defect detection.

A laser below 120 nm improves wafer defect resolution while image capture and processing address weak signals and material contrast.

Rotation-synchronized area scanning forms accurate two-dimensional images while multiple cylindrical containers pass through one camera view.

X-ray inspection can miss embedded or attached foreign objects; transmitted visible or near-infrared light improves contrast and inspection accuracy.

Selectable laser spot sizes and line widths help surface inspection cover more area while preserving precision for small features.

R, G, and B board images are analyzed for complementary colors, selecting the brightest channel to improve component-mounting precision.

Rotating the sealed vial separates foreign substances from bubbles, enabling fixed light and imaging positions for simpler inspection.

An extendable-arm light fixture illuminates drywall and body panels while image filtering locates imperfections for immediate repair.

Synchronizing StatCoeff and HistValue at each TU improves Rice parameter accuracy, coding efficiency, and parallel video decoding.

Orthogonal oblique line lights and line sensors detect linear steel-surface defects in any orientation, improving inspection coverage.

Excitation light tuned between substrate absorption and emission peak wavelengths helps identify defective minute light-emitting elements.