Multilayer Single-Crystal Copper Lamination for Scalable High Conductivity
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Solution Overview
Problem
Current commercialized single-crystal copper materials are expensive and limited in area, making them unsuitable for large-scale applications in microelectronic industry and traditional power transmission.
Innovation Solution
A method involving the lamination of multiple layers of single-crystal copper foils, followed by pressurizing and annealing, or direct hot rolling, to produce an ultrahigh-conductivity multilayer single-crystal laminated copper material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bulk crystal growth or thin film deposition is used to prepare single-crystal copper, then single-crystal structure is achieved, but the material is expensive and limited in area
Solution Approach 1:
The invention divides the single-crystal copper material into multiple thin foil layers that are laminated together. Each foil layer maintains its single-crystal structure, and through hot rolling or pressurizing-annealing treatment, they form a multilayer single-crystal laminated structure that preserves the electrical properties of single-crystal copper while enabling large-scale production through conventional foil manufacturing techniques
Solution Approach 2:
The invention creates a composite structure by laminating multiple single-crystal copper foils together to form a multilayer single-crystal laminated copper material. This composite approach combines the advantages of single-crystal copper (high conductivity) with the manufacturability of foil-based materials, achieving both excellent electrical properties and scalability
2Area of stationary object
If multiple layers of single-crystal copper foils are laminated and pressurized-annealed or hot-rolled, then large-area single-crystal copper material is produced, but grain boundary formation may occur during processing
Solution Approach 1:
The invention carefully controls processing parameters including temperature (500-1100°C for pressurizing-annealing, or appropriate temperatures for hot rolling), pressure (0.5-200 MPa), and deformation amount to enable the laminated foils to bond together while maintaining their single-crystal structure. The parameters are optimized to prevent grain boundary formation during the consolidation process
Solution Approach 2:
The invention performs preliminary preparation by selecting foils with appropriate single-crystal orientations (such as <100>, <110>, or <111> orientations) before lamination. This preliminary orientation control ensures that the final laminated structure maintains excellent electrical properties and prevents grain boundary formation during subsequent processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method results in a copper material with conductivity greater than or equal to 105% IACS, suitable for large-scale applications in microelectronic industry and traditional power transmission, while reducing production costs.
Implementation Method 1
pressurizing and annealing the laminate as one piece by performing pressurizing and high-temperature annealing at the same time
Implementation Method 2
pressurizing and annealing the laminate as one piece... keeping the static pressure of 0.5 MPa to 200 MPa constant... when the temperature of the annealing furnace is raised to 500-1100° C.
Implementation Method 3
pressing the laminate as one piece by means of direct hot rolling... placing it in front of a hot roller of a hot rolling mill... elevating the temperature of the hot roller... keeping the pressure between the hot rollers of 0.5 MPa to 200 MPa constant
Data Source
AI summary
Provided is a preparation method for an ultrahigh-conductivity multilayer single-crystal laminated copper material, where multiple layers of single-crystal copper foils are laminated together to form a laminate, and the laminate is pressurized and annealed as one piece by performing pressurizing and high-temperature annealing at the same time, or the laminate is pressed as one piece by means of direct hot rolling, thereby obtaining an ultrahigh-conductivity multi-layer single-crystal laminated copper material, whereby, according to the method, multiple layers of single-crystal copper foils are used as raw materials, an ultrahigh-conductivity multi-layer single-crystal laminated copper material is prepared by means of hot rolling or pressing and annealing, and the conductivity of the copper material is greater than or equal to 105% IACS.