Single Crystal Silicon EUV Pellicle with Porous Support

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Solution Overview

Problem

Current pellicle films for EUV lithography are not highly transmissive to extreme ultraviolet light and are chemically unstable, leading to decreased transmittance over time due to amorphous or polycrystalline silicon films with high absorptivity and oxidation issues.

Innovation Solution

A pellicle film made of single crystal silicon supported by a porous structure with an anti-oxidizing film and gas filters, manufactured using a SOI substrate with partial removal of the handle substrate by dry etching, ensuring mechanical strength and chemical stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If amorphous or polycrystalline silicon films are used as pellicle films, then the manufacturing process is simplified, but the transmittance to EUV light decreases due to high absorptivity

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidtransmittance to EUV light
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The invention changes the crystalline structure parameter of silicon from amorphous or polycrystalline to single crystal. This parameter change fundamentally reduces the absorption coefficient for EUV light while maintaining compatibility with existing semiconductor manufacturing processes through SOI substrate utilization.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention creates a composite structure combining single crystal silicon layer with handle substrate and porous layer. This composite approach leverages the high transmittance of single crystal silicon while using the handle substrate and porous structure to provide mechanical support and control stress.

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If conventional silicon films are used, then the pellicle can be manufactured, but chemical stability deteriorates due to oxidation

Engineering Contradiction:
ImprovemanufacturabilityVSAvoidchemical stability
Core Design Contradiction:
Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The invention creates an inert environment by introducing a porous layer that prevents oxygen access to the single crystal silicon surface. This protective barrier maintains chemical stability by excluding oxidizing agents from the silicon material.

Inventive Principle:
Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The porous layer acts as an intermediary barrier between the single crystal silicon and the external environment. This intermediate layer protects the silicon from direct contact with oxygen while allowing the pellicle to function in its intended application environment.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If the pellicle film is made ultrathin to improve transmittance, then EUV light transmission increases, but mechanical strength decreases making it difficult to maintain constant tension

Engineering Contradiction:
Improvetransmittance to EUV lightVSAvoidmechanical strength
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The invention employs a nested structure where the ultrathin single crystal silicon layer is supported by the handle substrate and porous layer. This nested configuration allows the thin film to benefit from mechanical support from underlying structures while maintaining its high transmittance properties.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The invention utilizes the inherent flexibility and thin film characteristics of single crystal silicon to create an ultrathin pellicle that can conform to the photomask surface while maintaining structural integrity through the supported configuration.

Inventive Principle:
Principle #30Flexible shells and thin films

4Ease of operation

If stress is applied to the silicon film during bonding to maintain tension, then the pellicle can function properly, but the film may be damaged due to excessive stress

Engineering Contradiction:
Improvefunctional performanceVSAvoidfilm integrity
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The invention provides beforehand cushioning by incorporating the handle substrate and porous layer structure that can absorb and distribute bonding stresses. This pre-configured support system prevents excessive stress concentration on the silicon film during the bonding process.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Solution Approach 2:

The porous layer serves as an intermediary that mediates stress distribution during bonding. It allows controlled stress application to maintain film tension while preventing excessive stress that would cause damage to the ultrathin silicon layer.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The single crystal silicon pellicle film exhibits significantly reduced absorption coefficients and improved chemical stability, maintaining high transmittance and mechanical integrity for EUV exposure.

Implementation Method 1

a pellicle film of single crystal silicon... which is a material that is highly transmissive to extreme ultraviolet light (EUV light)

Methodology Applied
Scientific EffectLight transmission through single crystal silicon: Absorption (EM radiation)

Implementation Method 2

a support member including an outer frame portion and a porous portion that occupies an inner area surrounded by the outer frame portion

Methodology Applied
Scientific EffectMechanical support through porous structure: Porosity

Implementation Method 3

manufacturing method thereof... manufactured using a SOI substrate with partial removal of the handle substrate by dry etching

Methodology Applied
Scientific EffectDry etching: Plasma

Data Source

PatentEP2423747B1Pellicle for lithography and manufacturing method thereof
Publication Date: 2021.06.16 SHIN ETSU CHEMICAL CO LTD
  • EP2423747B1 patent drawingFigure 1
  • EP2423747B1 patent drawingFigure 2A~2B
  • EP2423747B1 patent drawingFigure 3

AI summary

A pellicle for lithography according to the present invention comprises a pellicle film (10) of single crystal silicon, and the pellicle film (10) is supported by a support member (20) including an outer frame portion (20a) and a porous portion (mesh structure) (20b) that occupies an inner area surrounded by the outer frame portion (20a). In order to prevent oxidation of surfaces of the pellicle film 10, anti-oxidizing films 30a and 30b are provided to cover portions where the single crystal silicon film is exposed to the outside. The support member (20) can be obtained by processing a handle substrate of an SOI substrate, and the pellicle film (10) of single crystal silicon can be obtained from an SOI layer of the SOI substrate. Since the pellicle film (10) is tightly coupled to the support member (20), sufficient mechanical strength can be assured.