Single Heat Sink Mounting for Resin-Molded Electronic Components
Solution Overview
Problem
In high-density, downsized electronic circuit boards used in vehicles and industrial machinery, efficient heat dissipation is challenging due to overheating in narrow areas, requiring effective heat sink mounting and manufacturing simplicity.
Innovation Solution
A mounting structure featuring electronic components with resin-molded lead portions and a heat sink where the components' back surfaces are on the same plane, allowing a single heat sink to be directly attached, with resin films for insulation and easy integration into the circuit board's recesses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple heat sinks are mounted on electronic components, then heat releasing property is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent merges multiple heat sinks into a single integrated heat dissipation structure that contacts multiple electronic components simultaneously. Instead of mounting separate heat sinks on each component, one heat sink is designed to engage with multiple components' protruding portions, reducing the number of heat sink units from multiple to one while maintaining effective heat release from all components.
Solution Approach 2:
The heat sink is designed with a universal structure that can serve multiple electronic components at once. The heat sink includes multiple heat sink portions that can respectively contact different electronic components, allowing a single heat sink to perform the heat dissipation function for multiple components simultaneously, thereby simplifying the overall mounting structure.
2Productivity
If electronic components are densely mounted, then productivity and integration are improved, but heat dissipation becomes difficult due to overheating in narrow areas
Solution Approach 1:
The patent utilizes the vertical dimension (thickness direction) for heat dissipation pathways. Electronic components are designed with protruding portions that extend toward the heat sink in the thickness direction of the substrate, allowing heat to be conducted from the component bodies through the protruding portions to the heat sink, thereby enabling effective heat dissipation even in high-density mounting configurations where lateral space is limited.
3Adaptability or versatility
If different thicknesses of leads and resin molds are used, then adaptability is improved, but manufacturing precision and ease of manufacture deteriorate
Solution Approach 1:
The patent standardizes the thickness parameters of the resin mold portions and lead portions to be equal, creating a uniform protruding height across all electronic components. This parameter standardization ensures that all components' protruding portions reach the same position in the thickness direction, enabling consistent contact with the heat sink and simplifying manufacturing processes while maintaining design flexibility through other means.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation while simplifying manufacturing and achieving a thin, efficient heat sink mounting solution for high-density electronic components.
Implementation Method 1
a heat sink for releasing heat generated from the plurality of electronic components
Implementation Method 2
heat sink for releasing heat generated from the plurality of electronic components
Implementation Method 3
resin films disposed between the plurality of electronic components and the heat sink
Data Source
AI summary
There is provided a mounting structure of electronic components wherein the heat sink is disposed so as to allow a high heat releasing property to be achieved and ensure that manufacturing is easy. The resin film is provided at the lower surface side of the whole circuit element to which the lead is connected; a molding resin is molded at the upper side from the lower surface of the lead including the side portions of the lead, the circuit element and the connecting portions of the lead and the circuit element; the lead is connected to the electrode of the circuit board so that flattened back surfaces of a plurality of one side resin-molded elements are on the same horizontal plane; and a single heat sink is mounted on the back surfaces of the plurality of one side resin-molded elements.