Single-Layer Burn-In Test Board Layout for Uniform Temperature
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Solution Overview
Problem
Existing burn-in test boards face challenges with temperature uniformity and manufacturing quality due to fine ball size and spacing of semiconductor devices, leading to potential manufacturing defects and increased costs.
Innovation Solution
A test board design with sub-boards arranged in a single-row single-layer structure on an interface board, allowing for parallel connection and improved airflow, ensuring temperature uniformity and enabling high-speed processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor devices are tested in matrix form on a large-area interface board, then processing capacity is increased, but manufacturing quality deteriorates due to extremely small ball size and spacing
Solution Approach 1:
The test board is divided into multiple sub-boards, each capable of holding a limited number of semiconductor devices. This segmentation allows each sub-board to maintain manageable ball size and spacing requirements while collectively increasing processing capacity through parallel testing across multiple sub-boards.
2Productivity
If multiple test boards are stored together in the burn-in chamber, then processing capacity is increased, but temperature uniformity deteriorates
Solution Approach 1:
The test board is segmented into multiple sub-boards arranged in a single row, which improves airflow patterns and heat distribution. This segmentation allows for better thermal management while maintaining high processing capacity through parallel testing.
Solution Approach 2:
The sub-boards are arranged in a single-row configuration rather than stacking multiple complete test boards vertically. This dimensional change optimizes airflow and heat distribution across the test board, ensuring temperature uniformity while maintaining processing capacity through parallel sub-board testing.
3Ease of manufacture
If sub-boards are connected in parallel to the interface board, then manufacturing cost is reduced and productivity is improved, but device complexity increases
Solution Approach 1:
The test board is divided into multiple sub-boards that can be independently manufactured and then connected in parallel to the interface board. This segmentation simplifies manufacturing by allowing modular production of individual sub-boards while reducing overall device complexity through standardized connection interfaces.
Data Source
AI summary
Proposed is a test board for a burn-in test. According to a specific embodiment of the present technology, in a basic-type test board that supplies a test signal of a PGB to sockets of sub-boards, each sub-board is arranged in a single-row single-layer structure on one interface board or FTB, so the height of the test board can be lowered compared to a conventional test board, thereby enabling smooth airflow, and a plurality of semiconductor devices can be tested in a uniform environment, thereby improving the durability of the test board. Furthermore, each sub-board is connected in parallel to the interface board or FTB, so a test signal can be simultaneously supplied to sockets of each sub-board through each sub-connector, thereby enabling high-speed processing. Moreover, each sub-board can be configured in various types and sizes, so the productivity of a test board circuit board can be increased.