Singulated Subpanel Semiconductor Packaging for Smaller Reliable Units
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Solution Overview
Problem
Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to inadequate performance.
Innovation Solution
A method involving the use of a subpanel substrate with a dielectric and conductive structure, where electronic components are coupled to conductive structures on both sides, and external interconnects are added, followed by singulating the substrate to create individual units, utilizing techniques like laser cutting or laser-assisted bonding to enhance manufacturing efficiency and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional semiconductor packages are used, then manufacturing is simpler, but package size is too large and reliability is decreased
Solution Approach 1:
The substrate is divided into multiple singulated portions, allowing individual processing and assembly of smaller units rather than handling large conventional packages. This segmentation enables reduced package size while maintaining reliability through precise individual assembly.
Solution Approach 2:
Electronic components are coupled to conductive structures on both sides of the substrate, utilizing bidirectional connectivity to reduce the overall package footprint. This dimensional approach allows more efficient space utilization and smaller package size.
2Productivity
If conventional semiconductor packages are used, then manufacturing processes are traditional, but cost is excessive and performance is low
Solution Approach 1:
Electronic components are coupled to the conductive structures before the substrate is singulated into final units. This preliminary assembly approach streamlines manufacturing by performing operations on larger substrates that are easier to handle, reducing overall manufacturing cost and improving efficiency.
Solution Approach 2:
Laser technology is used for cutting and bonding operations, replacing traditional mechanical methods. This substitution improves manufacturing precision, reduces costs through automation, and enhances overall productivity.
3Reliability
If conventional packages are used, then design is traditional, but electrical coupling is insufficient and performance is decreased
Solution Approach 1:
Conductive structures are strategically positioned on both sides of the substrate with specific patterns optimized for electrical coupling. This localized optimization of conductive pathways enhances electrical connectivity and signal integrity without requiring excessive overall complexity.
Solution Approach 2:
The substrate incorporates both dielectric and conductive structures in a composite configuration, enabling sophisticated electrical coupling capabilities. This composite approach allows for enhanced performance through integrated material properties while managing complexity systematically.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces package size, enhances electrical coupling, and improves reliability while maintaining cost-effectiveness, allowing for efficient production of semiconductor devices.
Implementation Method 1
utilizing techniques like laser cutting or laser-assisted bonding to enhance manufacturing efficiency and reliability
Data Source
AI summary
In one example, a semiconductor device can comprise a unit substrate comprising a unit conductive structure and a unit dielectric structure, and an electronic component coupled to the unit conductive structure. The unit substrate can comprise a portion of a singulated subpanel substrate of a panel substrate. Other examples and related methods are also disclosed herein.