Singulation Blade Cooling with Synthetic Lubricant
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Solution Overview
Problem
Conventional singulation processes for semiconductor devices are hindered by lengthy processing times, defects, and blade overheating due to high friction and particle buildup, which are not adequately addressed by using deionized water as a coolant and lubricant at higher speeds.
Innovation Solution
The use of a synthetic lubricant that cools and lubricates the singulation blade, reducing friction and particle buildup by injecting it into the kerf, allowing for higher spindle and table speeds while maintaining product quality and extending blade life.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the singulation blade is operated at higher rotational speed to accelerate the singulation process, then productivity is improved, but blade temperature increases resulting in lower cutting efficiency and higher blade wear
Solution Approach 1:
The patent introduces deionized water as an intermediary substance to cool and lubricate the singulation blade during high-speed operation. The water is applied through a cooling device that directs it to the blade contact point, serving as a mediator between the blade and the kerf to reduce friction and heat generation, thereby enabling higher rotational speeds without excessive blade temperature
Solution Approach 2:
The patent employs a hydraulic cooling system using deionized water delivered through nozzles or a cooling device positioned near the blade. This hydraulic approach allows precise delivery of coolant to the cutting zone, effectively managing blade temperature during high-speed singulation operations
2Productivity
If deionized water is used to cool and lubricate the blade at higher speeds, then productivity is improved, but the water forms high tension beads that do not adequately cool and lubricate the blade or remove particle buildup
Solution Approach 1:
The patent changes the physical parameters of the cooling fluid by using deionized water with controlled surface tension properties. By adjusting water quality (deionization) and potentially adding surfactants, the fluid's ability to wet surfaces and penetrate the kerf is improved, allowing it to effectively cool and lubricate the blade at high speeds without forming problematic high-tension beads
3Productivity
If the blade moves at higher table speed to reduce singulation time, then productivity is improved, but particle buildup on and around the blade increases leading to higher friction and power consumption
Solution Approach 1:
The patent applies deionized water to the blade and kerf area before significant particle buildup occurs. This preliminary cooling and lubrication action prevents particles from adhering to the blade and kerf walls, maintaining low friction conditions throughout the cutting process even at high table speeds, thereby preventing excessive power consumption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables faster and more efficient singulation with reduced power consumption and fewer defects, as evidenced by lower current draw and improved delamination test results under stress conditions.
Implementation Method 1
high friction and particle buildup, which are not adequately addressed by using deionized water as a coolant and lubricant
Implementation Method 2
The use of a synthetic lubricant that cools and lubricates the singulation blade
Implementation Method 3
The use of a synthetic lubricant that cools and lubricates the singulation blade, reducing friction and particle buildup
Implementation Method 4
injecting it into the kerf, allowing for higher spindle and table speeds while maintaining product quality
Data Source
AI summary
A method of singulating semiconductor devices applies a blade to a molded strip that includes the semiconductor device. The blade generates a kerf at a contact point between the blade and the molded strip. The kerf is filled with a plurality of particles. The kerf separates the semiconductor device from the molded strip. The method cools the blade by using a synthetic lubricant. The method lubricates the blade by using the synthetic lubricant. The method rinses the kerf by using the synthetic lubricant. Rinsing the kerf removes a substantial quantity of the particles from the kerf. A system singulates semiconductor devices from a molded strip by using a blade, a temperature control device, and a synthetic lubricant. The blade singulates the semiconductor device from the molded strip. The temperature control device applies the synthetic lubricant to the blade. The synthetic lubricant cools, lubricates, or rinses the blade, or a combination thereof, during a singulation process.