Grinding Feed Control TRIZ Cases
- Automated Sanding System with Dual Thickness Measurement
A sanding system uses leading and trailing roller assemblies to measure component thickness during automated processing.
- Finishing Tool Infeed Control for Rotationally Symmetrical Workpieces
A finishing tool adjusts its infeed path based on a force signal proportional to contact pressure during rotation.
- Robotic Sanding System Using 3D Surface Models
A robotic sanding system uses a scanner to create a 3D surface model that guides the sanding effector across part surfaces.
- Polishing Pad Dressing via Rotational Direction Alternation
Alternating dresser rotation directions restores polishing pad asperities, reducing re-dressing frequency while maintaining wafer surface quality.
- Grinding Tool Wear Detection via Optical Sensor
Optical sensor system monitors grinding tool topography to replace empirical dressing schedules with condition-based maintenance.
- Rail Grinding Motor Orientation Control via Profile Scanning
Grinding motors adjust orientation and power based on real-time rail profile scans to correct surface defects.
- Grinding Apparatus Wafer Thickness Control
A grinding apparatus adjusts the rotational speed ratio between the spindle and chuck table to minimize cyclic thickness variations.
- Torque Monitoring for Roller Burnishing Blockage
Burnishing tool torque measurement detects rolling element blockage during cylindrical surface processing.
- Grinding Tool Coolant Flow Control for Semiconductor Wafer Processing
Adjusting coolant flow by grinding tooth height prevents aquaplaning and extends tool service life during semiconductor wafer grinding.
- Grinding Disc Eccentric Speed Detection via Wave Reflection
A grinding disc uses wave reflection to measure random eccentric orbital motion speed for precise automation control.
- Wafer Rear Surface Grinding Method for Uniform Thickness
Segmenting rough and finishing stages with specific grindstones maintains transverse rupture strength while improving processing efficiency.
- Threaded Grinding Wheel Phasing via Acoustic Emission Detection
Acoustic emission fluid sensor detects elastic waves from threaded grinding wheel contact with a disk dresser to enable precise phasing.
- Eddy Current Sensor Array for Grinding Burn Detection
Eddy current sensor array detects microstructural changes during grinding to prevent thermal damage and reduce part waste.
- Grinding Disc Speed Detection via Non-Contact Wave Reflection
A grinding disc uses an active detection member to emit and receive waves for measuring orbital motion speed.