Sintered Heat Conducting Layer for Semiconductor Package Thermal Management
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Solution Overview
Problem
Semiconductor packages face challenges in heat dissipation, moisture resistance, and mechanical stability, particularly in package-on-package stacking configurations, which affect chip reliability.
Innovation Solution
A sintered heat conducting layer is introduced between semiconductor chips or between a chip and an electrical insulator, providing both electrical conductivity and improved heat transfer, and is fabricated using nano-paste material for enhanced thermal and mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a semiconductor package uses package-on-package stacking configuration, then device integration and functionality are improved, but heat dissipation becomes insufficient
Solution Approach 1:
The patent employs a composite underfill material containing thermally conductive particles (such as aluminum oxide, aluminum nitride, or boron nitride) dispersed in a polymer matrix. This composite structure combines the adhesive and protective properties of the polymer with the high thermal conductivity of the particles, enabling effective heat dissipation while maintaining the package-on-package stacking configuration.
Solution Approach 2:
The thermally conductive underfill acts as an intermediary thermal pathway between the semiconductor chip and the external environment. It mediates heat transfer from the chip through the encapsulant material, providing a dedicated thermal conduction path that does not interfere with the electrical functionality or the stacked package structure.
2Productivity
If semiconductor chips are stacked in package-on-package configuration, then device density is improved, but resistance to moisture ingress decreases
Solution Approach 1:
The encapsulant material forms a protective shell or coating around the semiconductor chip and interconnect structures. This encapsulant layer acts as a barrier that seals the internal components from moisture and environmental contaminants, while allowing the package-on-package stacking configuration to maintain high device density.
Solution Approach 2:
The underfill material serves as a protective barrier layer between the chip and the external environment. Its composite structure with thermally conductive particles in a polymer matrix provides both mechanical protection and moisture resistance, enabling the stacked configuration to maintain both density and environmental protection.
3Adaptability or versatility
If semiconductor chips are stacked in package-on-package configuration, then integration is improved, but mechanical stability decreases
Solution Approach 1:
The underfill material is applied to the substrate or chip surface before mounting the semiconductor chip. This preliminary application creates a pre-formed adhesive and mechanically stable interface layer that ensures proper alignment, bonding, and mechanical stability of the stacked package structure before the chip is permanently attached.
Solution Approach 2:
The composite underfill material provides enhanced mechanical properties through the combination of polymer matrix and thermally conductive particles. This composite structure offers improved strength, rigidity, and dimensional stability, ensuring that the package-on-package stacking configuration maintains mechanical stability while achieving high integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved heat dissipation, increased resistance to moisture ingress, and enhanced mechanical stability, leading to improved chip reliability and functionality in semiconductor devices.
Implementation Method 1
a sintered heat conducting layer disposed between the electrical insulator and the first chip
Implementation Method 2
providing both electrical conductivity and improved heat transfer
Data Source
AI summary
A semiconductor device includes a first chip coupled to an electrical insulator, and a sintered heat conducting layer disposed between the electrical insulator and the first chip.