Sintered Resistance Layer for Accurate Surface Temperature Sensing
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Solution Overview
Problem
The thermal coupling between temperature-sensitive resistance materials and the surface of a body being measured is not optimal due to air gaps caused by the housing of existing electrical components, leading to distorted temperature measurements.
Innovation Solution
A method involving a non-sintered calcined metal oxide material, applied as a screen-printable ceramic paste to a non-electrically conductive carrier element, which is then sintered to create a temperature-dependent resistance layer with improved thermal and mechanical stability, allowing for direct and efficient thermal coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a housing surrounds the temperature-sensitive material, then the component is protected and structurally stable, but thermal coupling to the measured surface deteriorates due to air gaps
Solution Approach 1:
The invention extracts the temperature-sensitive resistance layer from its traditional enclosed housing and applies it directly to the carrier element's surface, eliminating the air gap between the sensing material and the measured surface. This direct application maintains component protection while achieving optimal thermal coupling for accurate temperature measurement.
Solution Approach 2:
The carrier element serves as an intermediary between the temperature-sensitive material and the measured surface. By applying the resistance layer directly to the carrier element surface, the invention creates an optimal thermal pathway that mediates between the need for component stability and the requirement for direct thermal contact with the measured surface.
2Stability of the object's composition
If a housing is used to contain the temperature-sensitive material, then the component maintains structural stability, but thermal coupling to the measured surface deteriorates
Solution Approach 1:
The invention extracts the temperature-sensitive resistance layer from its traditional enclosed housing structure and applies it directly to the carrier element surface. This elimination of the housing intermediary maintains structural stability through the carrier element while achieving optimal thermal coupling for accurate temperature measurement.
3Device complexity
If air gaps are present between the temperature-sensitive material and the measured surface, then component housing is simplified, but heat transfer from the surface to the material deteriorates
Solution Approach 1:
The invention extracts the temperature-sensitive resistance layer and applies it directly to the carrier element surface, eliminating air gaps that would impede heat transfer. This direct application maintains simplified component housing while achieving optimal thermal coupling and heat transfer efficiency from the measured surface to the sensing material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the stability and thermal coupling of temperature-sensitive electrical components, enabling precise temperature measurements with minimized thermal mass and allowing for complex resistance structures and miniaturization.
Implementation Method 1
The material is applied to a surface of the carrier element to create a resistance layer. To bond the resistance layer to the carrier element, the resistance layer is subsequently sintered.
Implementation Method 2
there is an air gap between the temperature-sensitive material and the component housing, which influences the heat transfer from the surface of the body to the temperature-sensitive material
Data Source
Figure 1
Figure 2A~2B
Figure 3A~3B
AI summary
Disclosed is a method for producing an electrical component, said method providing a support element (10) and a material with a temperature-dependent resistance. To create a resistance layer (20), the material is applied to one surface (O10) of the support element (10). The resistance layer (20) is then sintered to connect the resistance layer (20) to the support element (10).