Sintering Bonding Sheet Lamination for Accurate Chip Transfer
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Solution Overview
Problem
Conventional sintering bonding techniques for semiconductor devices face inefficiencies in applying sinterable particle compositions uniformly and consistently, leading to issues like chip position aberration and inadequate integration of thin sheets, which affect the yield and reliability of semiconductor devices, especially in high-temperature applications.
Innovation Solution
A sheet for sintering bonding comprising an electrically conductive metal containing sinterable particles and a binder component, optimized with specific load-displacement properties measured by nanoindentation, ensures high adhesive strength and separability, facilitating efficient lamination, integration, and transfer of materials to semiconductor chips while minimizing position aberration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a pasty sinterable particle containing composition is applied to every semiconductor chip individually, then uniform application and consistent bonding quality can be achieved, but production efficiency and productivity are reduced
Solution Approach 1:
The sheet for sintering bonding is divided into multiple independent bonding regions, each corresponding to a semiconductor chip position. This segmentation allows individualized control of bonding material distribution while enabling collective processing of multiple chips simultaneously, thus maintaining bonding quality consistency without sacrificing production efficiency
Solution Approach 2:
The sinterable particles and binder component are pre-distributed in specific patterns within the sheet before bonding. This preliminary arrangement ensures that when the sheet is applied to multiple semiconductor chips, each chip receives the appropriate amount and distribution of bonding material, eliminating the need for individual application while maintaining consistency
2Reliability
If multiple thin sheets for sintering bonding are laminated and integrated to achieve predetermined thickness, then adequate bonding performance can be achieved, but integration difficulty and process complexity increase
Solution Approach 1:
Multiple thin sheets for sintering bonding are laminated together to form a single integrated sheet with predetermined thickness. This merging approach combines the bonding capabilities of multiple layers while maintaining uniform material distribution and adhesive properties throughout the composite structure, achieving adequate bonding performance without excessive process complexity
Solution Approach 2:
The laminated sheet structure creates a composite material system where multiple layers of sintering bonding material are combined with complementary properties. This composite construction enhances overall bonding performance through synergistic effects while the standardized lamination process keeps manufacturing complexity manageable
3Productivity
If sheet for sintering bonding is pressed against semiconductor chip array and then separated, then collective supply of bonding material can be achieved, but position aberration and transfer precision are reduced
Solution Approach 1:
The sheet for sintering bonding features locally optimized bonding regions with specific adhesive strength characteristics tailored to each semiconductor chip position. This local quality variation ensures strong adhesion during pressing for collective material supply, while controlled separability at defined boundaries maintains chip position accuracy and prevents unwanted material transfer
Solution Approach 2:
The adhesive properties of the sheet are optimized through controlled parameters of the binder component and sinterable particle distribution. These parameter adjustments create a bonding strength profile that allows reliable attachment during collective processing but enables clean separation at appropriate stages, thereby maintaining position accuracy while achieving efficient material supply
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optimized sheet for sintering bonding enhances operational efficiency by ensuring satisfactory adhesiveness and preventing chip position aberration, thereby improving the yield and reliability of semiconductor devices, particularly in high-temperature applications.
Implementation Method 1
a heating step is carried out under predetermined temperature and pressurization conditions such that volatilization of the solvent and the like in the material for sintering bonding occurs between the supporting substrate and the semiconductor chip thereon, and sintering between sinterable particles proceeds
Implementation Method 2
a sheet for sintering bonding, which comprises an electrically conductive metal containing sinterable particle (1) and a binder component (2)
Data Source
AI summary
To provide a sheet for sintering bonding and the same with a base material suited for lamination and integration and also suited for realizing satisfactory operational efficiency in a sintering process in a process of producing semiconductor devices that go through sintering bonding of semiconductor chips. A sheet for sintering bonding 10 of the present invention comprises an electrically conductive metal containing sinterable particle and a binder component. In this sheet, the minimum load, reached during an unloading process in load-displacement measurement according to a nanoindentation method, is −100 to −30 μN. Alternatively, the ratio of the minimum load to a maximum load, reached during a load applying process in the above measurement, is −0.2 to −0.06. A sheet body X, a sheet for sintering bonding with a base material of the present invention, has a laminated structure comprising a base material B and the sheet 10.