Substrate-Free SIP Module Shielding EMI

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Solution Overview

Problem

Semiconductor devices in high-frequency applications, such as RF wireless communications, face interference issues due to electromagnetic interference (EMI), radio frequency interference (RFI), and inter-device interference, which can affect their operation, and the substrate-based SIP modules have limitations in design flexibility, increased thickness, and higher manufacturing costs.

Innovation Solution

The formation of a system-in-package (SIP) module over a penetrable film layer, which allows semiconductor die and discrete IPDs to be mounted without a substrate, enabling a shielding layer to be applied directly over the encapsulant, reducing interference and providing structural support through an encapsulant, while allowing for higher design flexibility and reduced manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a substrate is used to mount semiconductor die and discrete IPDs, then structural support is provided, but design flexibility is limited, profile thickness increases, and manufacturing cost increases

Engineering Contradiction:

Improvestructural supportVSAvoiddesign flexibility

Core Design Contradiction:

StrengthVSAdaptability or versatility

Solution Approach 1:

The patent removes the substrate from the SIP module structure, extracting only the essential mounting function. Semiconductor die and discrete IPDs are mounted directly to the encapsulant, eliminating the substrate layer that limited design flexibility and increased thickness.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The encapsulant serves multiple functions: it provides structural support, electrical isolation, and mechanical mounting for semiconductor components. By making the encapsulant multi-functional, the patent eliminates the need for a separate substrate while maintaining structural integrity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Strength

If a substrate is used to mount semiconductor die and discrete IPDs, then structural support is provided, but profile thickness increases

Engineering Contradiction:

Improvestructural supportVSAvoidprofile thickness

Core Design Contradiction:

StrengthVSLength of stationary object

Solution Approach 1:

The substrate layer is extracted from the module structure, removing the source of increased profile thickness. Components are mounted directly to the encapsulant, reducing the overall vertical dimension of the SIP module.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The mounting function previously separated into a distinct substrate layer is merged into the encapsulant structure. This consolidation eliminates the need for additional thickness to accommodate a separate substrate.

Inventive Principle:

Principle #5Merging (Combining)

3Strength

If a substrate is used to mount semiconductor die and discrete IPDs, then structural support is provided, but manufacturing cost increases

Engineering Contradiction:

Improvestructural supportVSAvoidmanufacturing cost

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The substrate is extracted from the manufacturing process, eliminating the steps required to fabricate, prepare, and assemble components onto a separate substrate board, thereby reducing manufacturing complexity and cost.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The encapsulant is designed to perform both protective and structural mounting functions simultaneously, eliminating the need for a separate substrate component and reducing the total bill of materials and assembly steps.

Inventive Principle:

Principle #6Universality (Multi-functionality)

4Adaptability or versatility

If discrete IPDs are integrated into SIP module, then electrical functionality is extended, but susceptibility to EMI, RFI, and inter-device interference increases

Engineering Contradiction:

Improveelectrical functionalityVSAvoidEMI, RFI, and inter-device interference

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

A shielding layer is introduced as an intermediary between discrete IPDs and the external environment. This shielding layer blocks EMI, RFI, and inter-device interference while allowing the IPDs to maintain their extended electrical functionality.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The shielding layer is applied in advance to prevent interference from affecting the IPDs. By establishing protective barriers before interference occurs, the design maintains electrical functionality while preemptively countering harmful electromagnetic effects.

Inventive Principle:

Principle #9Preliminary anti-action

Data Source

PatentUS11309193B2Semiconductor device and method of forming SIP module over film layer

Publication Date: 2022.04.19 STATS CHIPPAC MANAGEMENT PTE LTD

AI summary

A semiconductor device has a semiconductor die or component, including an IPD, disposed over an attach area of a penetrable film layer with a portion of the semiconductor die or component embedded in the penetrable film layer. A conductive layer is formed over a portion of the film layer within the attach area and over a portion of the film layer outside the attach area. An encapsulant is deposited over the film layer, conductive layer, and semiconductor die or component. The conductive layer extends outside the encapsulant. An insulating material can be disposed under the semiconductor die or component. A shielding layer is formed over the encapsulant. The shielding layer is electrically connected to the conductive layer. The penetrable film layer is removed. The semiconductor die or component disposed over the film layer and covered by the encapsulant and shielding layer form an SIP module without a substrate.