SiP Integration Test Vehicles Using Functional Reject HBM Devices
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Solution Overview
Problem
Existing daisy chain test vehicles (DCTVs) used in system-in-package (SiP) integration bringup processes require additional design and manufacturing steps, have different material compositions and mechanical properties than live products, and provide limited testing capabilities, leading to inaccurate characterization of compatibility between SiP devices and package substrates.
Innovation Solution
Utilize test vehicles, such as functional reject HBM devices with minimum basic functionality, integrated with a substrate to form a proxy device, which includes circuits and active components, enabling a wider range of tests, including AC connectivity and die crack detection, to accurately assess compatibility with package substrates and packaging processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If daisy chain test vehicles (DCTVs) are used in SiP integration bringup processes, then testing capability is provided, but material composition and mechanical properties differ from live products leading to inaccurate compatibility characterization
Solution Approach 1:
The patent uses functional reject HBM devices as test vehicles that copy the material composition, mechanical properties, and structural characteristics of live products. These test vehicles are created by taking HBM devices that failed functional tests during manufacturing and using them as proxies, ensuring they accurately represent the actual products being tested in terms of physical and mechanical properties.
Solution Approach 2:
The patent changes the functional status parameter of HBM devices from fully functional to functional reject, while maintaining all physical and mechanical parameters identical to live products. This allows the test vehicles to preserve the exact material composition and mechanical properties needed for accurate compatibility characterization while serving the testing function.
2Adaptability or versatility
If additional design and manufacturing steps are implemented for test vehicles, then testing capabilities are enhanced, but manufacturing complexity and costs increase
Solution Approach 1:
The patent recovers functional reject HBM devices that would otherwise be discarded and repurposes them as test vehicles. Instead of wasting these devices, the patent utilizes their existing structure, materials, and characteristics to conduct compatibility testing, thereby enhancing testing capabilities without adding new design or manufacturing steps.
Solution Approach 2:
The functional reject HBM devices serve dual purposes: they first fail functional testing during normal manufacturing, then automatically become test vehicles for compatibility assessment. This self-service approach eliminates the need for separate test vehicle design and manufacturing processes, as the rejected devices inherently possess the required characteristics for accurate testing.
3Reliability
If functional reject HBM devices are used as test vehicles, then material composition matches live products, but additional quality control filtering is required
Solution Approach 1:
The patent performs quality control filtering during the normal HBM device manufacturing process, identifying functional rejects before they leave the fabrication line. This preliminary action ensures that only devices with the correct material composition and physical properties are selected as test vehicles, while the filtering process is integrated into existing manufacturing workflows rather than adding separate steps.
Data Source
AI summary
Systems and methods related to test vehicles, such as test vehicles for system-in-package (SiP) integration bringup processes, are disclosed herein. In one embodiment, a method includes integrating a first test vehicle and a second test vehicle with an interposer such that the first test vehicle is communicably coupled to the second test vehicle via a native communication channel in the interposer. Thereafter, the interposer is integrated with a package substrate, thereby communicably coupling the first and second test vehicles to access pins of the package substrate. An external testing device is coupled to the access pins and executes one or more tests, such as to assess compatibility between (a) SiP devices resembled by the interposer and the first and second test vehicles and (b) the package substrate and/or corresponding packaging processes.