Slender LED Filament Layout With Integrated Control Bare Die
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional LED light-emitting devices have large volumes, limited applicability, poor reliability, and high costs due to synchronous flashing and separate packaging of control and luminous components, making them unsuitable for applications like filament products.
Innovation Solution
A light-emitting device with a slender substrate, conductive lines, control bare dies, and wiring terminals, where the control bare die controls the light-emitting bare die, and a zener diode limits voltage, integrated with a transparent medium layer for color conversion, and a manufacturing process involving die bonding, welding, and gluing to optimize component layout and reduce size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separately packaged control component and luminous component are assembled on circuit board, then control functions are achieved, but device volume becomes large
Solution Approach 1:
The patent merges the control component and luminous component into a single integrated LED chip structure. The control chip and luminous chip are combined in one device, eliminating the need for separate packaging and assembly on circuit boards. This integration directly reduces device volume while maintaining control functionality through internal signal processing pathways.
Solution Approach 2:
The patent transitions from a planar two-dimensional layout on circuit boards to a three-dimensional stacked architecture. The control chip and luminous chip are arranged in vertical layers within a compact package, utilizing the third dimension (height/depth) to accommodate multiple functional components without increasing the device's footprint area.
2Adaptability or versatility
If multiple packaged components are assembled on circuit board, then control and luminous functions are achieved, but device complexity increases
Solution Approach 1:
The patent combines multiple functional components (control chip, luminous chip, resistors, capacitors) into a single integrated LED device package. This merger eliminates the complex multi-step assembly process of mounting separate components on circuit boards, reducing manufacturing complexity while preserving all necessary control and luminous functions through internal integration.
Solution Approach 2:
The integrated LED chip structure serves multiple functions simultaneously - control signal processing, current regulation, light emission, and signal transmission - all within a single device unit. This multi-functionality eliminates the need for separate dedicated components for each function, simplifying the overall device architecture and assembly process.
3Ease of operation
If traditional LED light string flashing mode is used, then synchronous flashing is achieved, but reliability decreases
Solution Approach 1:
The patent divides the LED light string into independently controllable segments or units, each with its own integrated control and luminous components. This segmentation allows individual units to operate autonomously, so that failure in one unit does not affect the entire string, thereby improving reliability while maintaining flexible flashing patterns through coordinated control of multiple segments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a smaller, more reliable, and cost-effective light-emitting device with expanded applicability, capable of achieving complex luminous effects and 360-degree illumination, suitable for various scenes including bulb products.
Implementation Method 1
the transparent medium layer containing phosphor powder can realize the conversion of luminous effect
Data Source
AI summary
A light-emitting device, a bulb and a manufacturing process thereof are disclosed. The light-emitting device includes a substrate, on which a conductive line, a control bare die, a light-emitting bare die and a wiring terminal are arranged. The conductive line is electrically connected with the control bare die and/or the wiring terminal and/or the light-emitting bare die. The control bare die is configured to control the switch and/or current of the light-emitting bare die, and the wiring terminal is externally connected with a power supply; the present disclosure reduces the volume, expands the applicable scene and reduces the cost by optimizing the layout of the substrate, the conductive line, the control bare die, the light-emitting bare die and the wiring terminal, and setting the slender substrate.