Sliding Manifold Assembly for Thermal Regulation of Stacked Electronics
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Solution Overview
Problem
Existing thermal regulation devices for electronic components lack flexibility in mounting and ensure effective thermal contact, particularly in applications like data centers and automotive batteries, due to fixed assembly after brazing, which restricts the insertion and stacking axis of energy storage elements.
Innovation Solution
A thermal regulation device with heat transfer fluid circulation ducts and manifolds featuring sliding connectors and collars allows for flexible insertion and compression of electronic components, ensuring effective thermal contact through modular design and compression.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If thermal regulation device is fixed after brazing, then manufacturing precision is improved, but adaptability deteriorates
Solution Approach 1:
The patent makes the thermal regulation device dynamically adjustable by replacing fixed brazed connections with sliding connectors that can move along the stacking axis. This allows the device to adapt its configuration after assembly while maintaining precise thermal contact through controlled compression.
Solution Approach 2:
The invention segments the thermal regulation device into modular components (circulation ducts, sliding connectors, collars) that can be independently positioned and assembled. This segmentation enables flexible stacking arrangements while maintaining manufacturing precision through standardized interfaces.
2Manufacturing precision
If circulation ducts are fixed in position, then manufacturing precision is improved, but ease of operation deteriorates
Solution Approach 1:
The circulation ducts are made dynamically positionable through sliding connectors that allow movement along the stacking axis during assembly. This enables easy insertion of electronic components between ducts while maintaining precise final positioning through compression and sealing mechanisms.
Solution Approach 2:
The sliding connectors are pre-configured with collars and sealing elements that prepare the ducts for precise positioning and sealing before final assembly. This preliminary preparation facilitates easy component insertion while ensuring accurate duct positioning is achieved during the assembly process.
3Reliability
If device is compressed for thermal contact, then thermal regulation effectiveness is improved, but device complexity increases
Solution Approach 1:
The device uses dynamic compression mechanisms with sliding connectors that can be compressed along the stacking axis to ensure thermal contact. This dynamic compression feature maintains thermal effectiveness while avoiding overly complex assembly mechanisms through straightforward linear movement and sealing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible mounting and effective thermal regulation of electronic components by allowing spacing and compression, reducing the need for additional thermal interfaces and enhancing thermal contact, thus optimizing temperature management.
Implementation Method 1
The device has at least two circulation ducts (5) for a heat transfer fluid which are arranged along a stacking axis (A1)
Implementation Method 2
at least one hollow connector (11) interposed between two fluidic connection portions (9, 109) along the stacking axis (A1), and having two opposite end sections (111) mounted so as to be able to slide inside the collars (95) of two facing fluidic connection portions (9, 109)
Implementation Method 3
The end sections form beads which provide the sealing function of said at least one heat transfer fluid manifold
Implementation Method 4
the stacking axis (A1) of the device (1, 101), and then to compress the assembly when the electronic components have been inserted. The compression also ensures that effective thermal contact can be made between the circulation ducts and the interposed electronic components
Data Source
AI summary
The invention relates to a device for thermal regulation of at least one electronic component, including at least two circulation conduits of a heat transfer fluid, arranged along a stacking axis, and at least one heat transfer fluid manifold in fluidic communication with the circulation conduits. The heat transfer fluid manifold includes at least two fluidic connection portions, respectively assembled at one end of a corresponding circulation conduit and having, respectively, at least one collar bordering an orifice, and at least one hollow connector interposed between two fluidic connection portions along the stacking axis, and having two opposite end sections, slidably mounted inside the collars of two facing fluidic connection portions.