Sliding Thermal Interface for CTE Mismatch in IC Packaging
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Solution Overview
Problem
Current integrated circuit architectures face challenges in efficiently processing large data sets for artificial intelligence applications, leading to prolonged data processing times and economic inefficiencies, as well as issues with thermal management and packaging due to coefficient of thermal expansion mismatches.
Innovation Solution
An integrated circuit architecture with a slidable thermal interface using a combination of thermally conductive and friction reduction materials, such as indium and polytetrafluoroethylene, to enhance data processing capabilities and address thermal management, along with an elastomeric connector for CTE mismatch compensation, enabling direct die-to-die connectivity and efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional rigid thermal interface materials are used between substrates with varying coefficients of thermal expansion, then thermal contact is maintained, but thermal stress and potential damage occur due to CTE mismatch during temperature cycling
Solution Approach 1:
The patent applies parameter changes by transitioning from rigid thermal interface materials to compliant materials that can dynamically adjust their mechanical properties. The compliant thermal interface material changes its state from rigid to flexible during temperature cycling, allowing it to accommodate CTE differences between substrates while maintaining thermal contact, thereby reducing thermal stress and improving interface reliability
Solution Approach 2:
The patent employs composite materials by combining thermally conductive properties with mechanical compliance in a single thermal interface material. This composite approach allows the material to simultaneously provide efficient heat transfer pathways while accommodating dimensional changes due to CTE mismatch, resolving the contradiction between maintaining thermal contact and reducing thermal stress
2Ease of manufacture
If conventional packaging methods are used for large-scale integrated circuits, then manufacturing is simplified, but thermal management becomes inadequate leading to overheating and performance degradation
Solution Approach 1:
The patent introduces an intermediary compliant thermal interface material between the integrated circuit substrate and the heat sink. This intermediary material serves as a mediator that maintains intimate thermal contact while accommodating substrate deformation, thereby improving heat dissipation efficiency without complicating the packaging process
Solution Approach 2:
The patent utilizes flexible thin film thermal interface materials that can conform to the substrate surface and maintain thermal contact under varying thermal conditions. These flexible films provide effective thermal management while keeping the packaging structure simple and manufacturable
3Device complexity
If fixed thermal interfaces are used between substrates with different CTEs, then assembly is simplified, but the interface cannot accommodate thermal expansion differences leading to delamination or failure
Solution Approach 1:
The patent applies dynamics by using a compliant thermal interface material that transitions from a fixed rigid state to a flexible adaptive state during thermal cycling. This dynamic response allows the interface to accommodate CTE differences between substrates, preventing delamination and maintaining bonding reliability without increasing structural complexity
Solution Approach 2:
The patent utilizes parameter changes in the mechanical properties of the thermal interface material, transitioning from rigid to compliant behavior under thermal stress. This parameter change enables the interface to absorb expansion differences while maintaining structural integrity and bonding reliability, all within a simple interface structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces data processing time, enhances bandwidth, and mitigates thermal stress and packaging issues by allowing for efficient heat transfer and CTE mismatch absorption, resulting in improved performance and reliability of large-scale integrated circuits.
Implementation Method 1
a thermally conductive material arranged along a surface of the heat transfer element
Implementation Method 2
a friction reduction material arranged along a surface of the semiconductor substrate, wherein opposing surfaces of the thermally conductive material and the friction reduction material define a slidable interface
Implementation Method 3
an elastomeric connector for CTE mismatch compensation
Data Source
AI summary
Systems and methods include an integrated circuit assembly that includes a semiconductor substrate; a heat transfer element; and an ambulatory thermal interface arranged between the semiconductor substrate and the heat transfer element, the ambulatory thermal interface comprising: a thermally conductive material, and a friction reduction material, wherein: the thermally conductive material is arranged along a surface of the heat transfer element, the friction reduction material is arranged along a surface of the semiconductor substrate, opposing surfaces of the thermally conductive material and the friction reduction material define a slidable interface when placed in contact.