Slotted Heat Slug Structure for Bond Wire Reliability in SOPs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional small outline packages (SOP) face manufacturing hurdles due to heat slugs obstructing wirebonding and limited heat dissipation, leading to wirebonding failures and reduced power density in high power electronic devices.
Innovation Solution
A heat slug design with lateral fins and slots is implemented, allowing slotted access for lead frame leads during wirebonding and increasing heat dissipation surface area, while maintaining structural support and bond wire integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the heat slug size is reduced to improve wirebonding access, then ease of manufacture improves, but heat dissipation capability deteriorates
Solution Approach 1:
The heat slug is extended in the vertical dimension by adding lateral fins that protrude from the sides of the heat slug body. This dimensional extension increases the heat dissipation surface area without increasing the horizontal footprint that would obstruct wirebonding access to the leads.
Solution Approach 2:
The heat slug is segmented into a central body portion and multiple lateral fin portions. The central body provides the core thermal mass and connection to the semiconductor die, while the segmented fins extend outward to increase surface area for heat dissipation without blocking lead access.
2Temperature
If lateral fins are added to increase heat dissipation surface area, then heat dissipation capability improves, but device complexity increases
Solution Approach 1:
The lateral fins are merged with the heat slug body to form a single integrated thermal management component. The fins are directly attached to and continuous with the heat slug, eliminating the need for separate heat dissipation components and reducing overall device complexity.
Solution Approach 2:
The heat slug with lateral fins serves multiple functions: it provides thermal conduction from the semiconductor die, acts as a heat dissipation structure through the fins, and maintains a compact form factor that does not interfere with wirebonding. This multi-functionality reduces the need for additional components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances bond wire reliability and heat dissipation, improving device performance and power density in high power electronic devices by facilitating robust wirebonding and efficient heat removal.
Implementation Method 1
The heat slug has a first portion partially exposed outside the second side of the package structure, and a second portion with slots extending inwardly along the first direction and fins between respective pairs of the slots, where the fins are enclosed by the package structure and spaced along an orthogonal second direction
Implementation Method 2
improving heat dissipation, maintaining effective heat removal despite reduced heat slug material volume
Data Source
AI summary
An electronic device includes a package structure, a lead, a heat slug, a semiconductor die, and a bond wire. The package structure has opposite first and second sides, and opposite third and fourth sides spaced along a first direction. The heat slug has a first portion partially exposed outside the second side of the package structure, and a second portion with slots extending inwardly along the first direction and fins between respective pairs of the slots, where the fins are enclosed by the package structure and spaced along an orthogonal second direction. The semiconductor die is attached to the heat slug, and the bond wire has a first end connected to the lead and a second end connected to a circuit of the semiconductor die.