Slurry Recycling via Flotation Module in CMP Systems
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Solution Overview
Problem
The continuous supply of slurry in chemical mechanical planarization (CMP) systems for semiconductor wafer polishing is costly and results in significant waste, leading to high manufacturing overhead and environmental pollution due to the constant need for fresh slurry and subsequent waste disposal.
Innovation Solution
Implementing a system that uses a combination of a raw slurry and a recycled slurry, where the recycled slurry is processed through a flotation module to separate by-products and abrasives, allowing for adjustable supply rates based on polishing characteristics, thereby reducing overall slurry consumption and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a continuous supply of fresh slurry is used in CMP systems, then polishing quality is maintained, but manufacturing cost increases and waste is generated
Solution Approach 1:
The patent implements a slurry recycling system where used slurry is collected from the polishing process, treated to remove contaminants and by-products, and then reused. This recovering process reduces slurry consumption and waste generation while maintaining sufficient polishing quality, directly addressing the contradiction between maintaining polishing quality and reducing slurry loss.
Solution Approach 2:
The system adjusts slurry parameters such as flow rate, composition, and treatment conditions to optimize the balance between polishing quality and slurry consumption. By changing these parameters, the system can maintain acceptable polishing results while using recycled slurry, thereby reducing overall slurry consumption and waste.
2Reliability
If fresh slurry is continuously supplied, then polishing performance is ensured, but manufacturing overhead increases
Solution Approach 1:
The recycling system recovers and reuses slurry that would otherwise be discarded, reducing the need for continuous fresh slurry supply and associated manufacturing overhead. The system maintains polishing performance through appropriate treatment and quality control of the recycled slurry.
Solution Approach 2:
The slurry treatment system is designed to be self-contained, with the polishing system itself generating and treating its own slurry waste. This reduces external dependencies and manufacturing overhead associated with continuous fresh slurry procurement and waste disposal.
3Productivity
If fresh slurry is continuously supplied, then polishing process continues, but environmental pollution increases
Solution Approach 1:
The system recovers slurry from the polishing process and treats it for reuse, significantly reducing the volume of waste slurry that would otherwise be discharged into the environment. This maintains continuous polishing operation while minimizing environmental pollution from slurry waste.
Solution Approach 2:
The system converts the harmful waste slurry into a beneficial resource by treating and recycling it. The waste slurry that would cause environmental pollution is instead processed and reused, transforming a harmful factor into a beneficial contribution to sustainable manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach decreases slurry consumption and manufacturing costs while maintaining polishing quality by optimizing the supply rates of both fresh and recycled slurries, thereby reducing waste and environmental impact.
Implementation Method 1
a flotation module to recycle the used slurry
Data Source
AI summary
The present disclosure describes an apparatus and a method for a chemical mechanical polishing (CMP) process that recycles used slurry as another slurry supply. The apparatus includes a pad on a rotation platen, a first feeder and a second feeder where each of the first and the second feeder is fluidly connected to a respective flow regulator and configured to dispense a first and a second slurry on the pad, a flotation module configured to provide a recycled slurry, and a detection module configured to detect a polishing characteristic associated with polishing the substrate. The flotation module further includes an inlet configured to provide a fluid sprayed from the pad and a tank configured to store chemicals that include a frother and a collector configured to chemically bond with the fluid.