Slurry Recycling via Flotation Module in CMP Systems
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The continuous supply of slurry in chemical mechanical planarization (CMP) systems for semiconductor wafer polishing is costly and results in significant waste, contributing to environmental pollution and high manufacturing overhead due to the constant need for fresh slurry and disposal of used slurry by-products.
Innovation Solution
A flotation module is integrated into the CMP system to recycle the used slurry by using chemicals such as a frother, collector, and modifier to separate and purify the slurry, converting CMP waste into a reusable slurry that can be reintroduced into the polishing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If fresh slurry is continuously supplied to the CMP system, then polishing quality is maintained, but manufacturing cost increases and waste is generated
Solution Approach 1:
The patent recovers and recycles used slurry from the CMP process through a flotation module that separates valuable slurry components from waste byproducts. The recovered slurry is then reused in the polishing process, eliminating the need for continuous fresh slurry supply while maintaining polishing quality.
Solution Approach 2:
The patent converts the harmful waste slurry that would normally be discarded into a beneficial resource by using flotation separation to recover usable slurry components. The waste stream becomes a source of reusable material, reducing both cost and environmental impact.
2Ease of operation
If used slurry is continuously disposed, then polishing process simplicity is maintained, but environmental pollution increases and manufacturing overhead increases
Solution Approach 1:
The patent converts the harmful waste slurry that would normally be discarded into a beneficial resource by using flotation separation to recover usable slurry components. The waste stream becomes a source of reusable material, reducing both cost and environmental impact.
Solution Approach 2:
The system performs its own waste treatment and material recovery through the flotation module, which automatically separates and recycles slurry components. This self-service approach handles waste management within the polishing system itself, reducing external environmental impact without requiring complex external treatment facilities.
3Loss of substance
If flotation module with chemicals is added to recycle slurry, then slurry consumption decreases, but device complexity increases
Solution Approach 1:
The patent extracts the slurry recycling function into a separate flotation module that can be integrated with the existing CMP system. This modular approach adds the necessary chemical separation capability without fundamentally redesigning the entire polishing system, managing complexity through functional decomposition.
4Reliability
If fresh slurry is continuously supplied, then polishing process reliability is maintained, but manufacturing cost increases
Solution Approach 1:
The patent recovers and recycles used slurry from the CMP process through a flotation module that separates valuable slurry components from waste byproducts. The recovered slurry is then reused in the polishing process, eliminating the need for continuous fresh slurry supply while maintaining polishing quality.
Solution Approach 2:
The patent establishes a continuous slurry recycling loop where used slurry is continuously recovered, processed, and fed back into the polishing system. This continuous circulation maintains reliable slurry supply without the discontinuous interruptions of fresh slurry replacement, ensuring consistent polishing performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the consumption of fresh slurry, decreases manufacturing costs, and minimizes environmental impact by effectively recycling and reusing the slurry, thereby maintaining consistent polishing quality and extending the life of polishing pads.
Implementation Method 1
a flotation module to recycle the used slurry... The flotation module includes a tank configured to store a first fluid including a frother, and an agitator configured to cause the frother to create bubbles in the first fluid in the tank
Implementation Method 2
The tank further includes an inlet configured to provide a second fluid to the tank, a first outlet configured to output a recycled slurry, and a second outlet fluidly connect to a drain... where the plurality of chemicals include a frother and a collector configured to bond the CMP waste with the bubbles
Data Source
AI summary
The present disclosure describes an apparatus and a method for a chemical mechanical polishing (CMP) process that recycles used slurry as another slurry supply. The apparatus includes a pad on a rotation platen, a first feeder and a second feeder where each of the first and the second feeder is configured to dispense a slurry on the pad, and a flotation module configured to process a first fluid sprayed from the pad. The flotation module further includes an oulet fluidly connected to the second feeder and configured to output a second fluid, and a first tank configured to store a plurality of chemicals where the plurality of chemicals include a frother and a collector configured to chemically bond with chemicals in the first fluid.