Synchronized Slurry Supply Vibration for CMP Uniformity
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Solution Overview
Problem
The CMP process in semiconductor manufacturing faces challenges in achieving sophisticated and reliable polishing performance due to limitations in the uniform distribution of polishing slurry, leading to defects and inefficiencies in planarization and surface finishing, especially with the increasing complexity and miniaturization of semiconductor devices.
Innovation Solution
A polishing device is designed with a slurry supply unit that performs a vibrating motion synchronized with the carrier's motion, ensuring uniform slurry distribution across the polishing surface, combined with a polishing pad featuring grooves and a urethane-based prepolymer composition for optimized polishing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional slurry supply method is used, then the polishing process is simple, but the slurry distribution is non-uniform leading to polishing defects
Solution Approach 1:
The slurry supply unit is configured to perform vibrating motion in synchronization with the carrier's motion. This vibration causes the slurry to distribute more uniformly across the polishing surface, preventing defects while maintaining a relatively simple system architecture without requiring complex flow control mechanisms
Solution Approach 2:
The slurry supply unit dynamically adapts its motion by vibrating in sync with the carrier's movement. This dynamic synchronization ensures that slurry is supplied uniformly across the entire polishing surface area as the carrier moves, resolving the uniformity issue without adding complex control systems
2Manufacturing precision
If the carrier performs vibrating motion for better slurry distribution, then polishing quality improves, but the synchronization control becomes complex
Solution Approach 1:
The slurry supply unit's vibrating motion is merged with the carrier's motion by synchronizing their vibrations. This combination allows both components to work together harmoniously, achieving uniform slurry distribution and high surface flatness without requiring independent complex control systems for each component
Solution Approach 2:
The synchronized vibrating motion of the slurry supply unit serves multiple functions: it enhances slurry distribution, maintains synchronization with carrier motion, and contributes to overall polishing quality. This multi-functionality reduces the need for separate dedicated systems, simplifying the overall control architecture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the uniformity and effectiveness of the polishing process, reducing defects and achieving high-quality semiconductor devices by ensuring optimal slurry distribution and surface interaction, thereby improving polishing flatness and process control.
Implementation Method 1
the slurry supply unit performs a vibrating motion at the same trajectory and speed as those of the vibrating motion of the carrier
Implementation Method 2
a polishing pad mounted on the surface plate; the polishing pad may include a polishing layer having a polishing surface, the polishing surface may include at least one groove
Data Source
AI summary
Provided are a polishing device including: a surface plate; a polishing pad mounted on the surface plate; a carrier for accommodating a polishing object; and a slurry supply unit including at least one nozzle, wherein the carrier performs a vibrating motion in a trajectory from the center of the surface plate to the end of the surface plate, and the slurry supply unit performs a vibrating motion at the same trajectory and speed as those of the vibrating motion of the carrier, as a polishing device which includes a slurry supply unit enabling subdivided driving in the supply of a polishing slurry, and in which the driving of the slurry supply unit has an advantage enabling optimized driving in an organic relationship between rotation and/or vibrating motion of the carrier and the surface plate and vertical pressurization conditions, etc. for the polishing surface of the carrier.