Small LED Chiplets for Heat Management and Efficiency

The patent divides a large LED into multiple small-sized LED chiplets (e.g., 20-100 micrometers in size) that can be distributed over a larger area. Each chiplet operates independently with lower power consumption and heat generation, enabling effective heat management while maintaining sufficient total light output through the combined emission of multiple chiplets.

The patent transitions from a single large LED operating in one dimension to multiple small chiplets distributed across a two-dimensional area. This spatial distribution allows heat to dissipate more effectively across a larger surface area while maintaining the required light output through the cumulative effect of multiple sources.

The patent employs selective area growth techniques during MOCVD fabrication to create precisely defined active regions within each chiplet. By controlling the local composition and structure of semiconductor layers in specific areas, the process achieves the required manufacturing precision for small chiplet dimensions while maintaining consistent quality across multiple chiplets.

The patent performs preliminary patterning and definition of active regions before final chiplet separation. This preliminary action establishes precise boundaries and structures that guide subsequent fabrication steps, ensuring that each small chiplet maintains the required dimensional accuracy and structural integrity after separation from the substrate.

The patent designs each small LED chiplet as a complete, functional unit that can operate independently. This universal design allows individual chiplets to be distributed across a larger area for improved heat management, while each chiplet maintains all necessary functional elements (electrodes, active regions, contact structures) to operate autonomously without requiring complex inter-chiplet interconnections.

The patent creates multiple identical copies of the same chiplet structure from a single substrate. This copying approach simplifies the overall device architecture by using repeated, standardized units rather than designing complex unique structures for each position. The uniformity of copied chiplets reduces fabrication complexity and facilitates systematic heat dissipation across the distributed array.