3D Smart Power Module Vertical Stacking for Heat Dissipation
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Solution Overview
Problem
Smart power modules with multiple semiconductor dice face issues such as leadframe deformation, wire bond failure, and heat dissipation challenges due to large package size and high temperatures, which can lead to device failure.
Innovation Solution
The development of an encapsulated semiconductor package with conductive regions for die bonding, a printed circuit board with vias connecting traces, and external pins, allowing for efficient attachment and heat management of multiple semiconductor devices in a single plane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large package size is used to accommodate multiple semiconductor devices, then the heat dissipation capacity is improved, but leadframe deformation and warpage occur
Solution Approach 1:
The patent transitions from a planar two-dimensional layout to a three-dimensional vertical stacking architecture. Multiple semiconductor devices are stacked vertically on top of each other, utilizing the third dimension (height) for device placement. This dimensional change allows multiple devices to be integrated in a compact footprint while maintaining effective heat dissipation paths to the substrate, thereby avoiding leadframe deformation associated with large planar packages.
Solution Approach 2:
The patent segments the semiconductor devices into discrete stacked units, each with its own substrate and heat dissipation path. The devices are divided into separate functional blocks that are vertically arranged, allowing independent thermal management for each segment. This segmentation enables efficient heat extraction from each device to its respective substrate without requiring a large overall package area, thus preventing leadframe warpage.
2Reliability
If multiple power devices are mounted on a metallic leadframe, then the electrical conductivity is improved, but the package becomes susceptible to deformation and warpage
Solution Approach 1:
The patent replaces the traditional planar leadframe mounting approach with a vertical stacking architecture. Multiple power devices are mounted vertically on substrates rather than being spread out on a large planar leadframe. This dimensional change maintains excellent electrical conductivity through the substrate trace networks while concentrating the device footprint in a compact vertical arrangement, thereby eliminating the thermal stress-induced deformation and warpage problems associated with large planar leadframe packages.
Data Source
AI summary
A 3D smart power module for power control, such as a three phase power control module, includes a two sided printed circuit (PC) board with power semiconductor devices attached to one side and control semiconductor devices attached to the other side. The power semiconductor devices are die bonded to a direct bonded copper substrate which has a bottom surface exposed in the molded package. In one embodiment the module has 27 external connectors attached to one side of the PC board and arranged in the form of a ball grid array.