Miniaturized SMD Diode Package Using Circuit Board and CCD Registration
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Solution Overview
Problem
Conventional lead frame-based packaging methods are inadequate for miniaturized SMD diode packages, leading to inaccuracies and potential failures due to the difficulty in precise installation of miniaturized diode chips.
Innovation Solution
The use of a circuit board instead of a conventional lead frame, combined with Charge-Coupled Device (CCD) image registration technology for chip bonding, simplifies the production process, improves precision, and ensures excellent diode characteristics without distortion or defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional lead frame packaging method is used, then the packaging process is established and can handle standard-sized chips, but the installation accuracy and precision deteriorate when packaging miniaturized diode chips
Solution Approach 1:
The patent extracts the lead frame from the packaging system and replaces it with a circuit board. This removes the problematic component that caused alignment issues with miniaturized chips, while retaining the essential function of electrical connection and mechanical support.
Solution Approach 2:
The patent introduces an intermediary positioning mechanism that includes positioning holes and positioning pins. This intermediary structure mediates between the circuit board and the miniaturized diode chip, enabling precise alignment and accurate placement that cannot be achieved with the lead frame alone.
2Reliability
If lead frame is used as both inner electrode and outer electrode, then the structure is integrated and simple, but the precision and reliability deteriorate for miniaturized diode packages
Solution Approach 1:
The patent segments the electrode functions into separate components: the circuit board serves as the inner electrode structure, while separate outer electrodes are attached to the circuit board. This segmentation allows each component to be optimized for its specific function, improving overall reliability for miniaturized packages.
Solution Approach 2:
The circuit board acts as an intermediary between the diode chip and the outer electrodes. This intermediary structure provides a stable, precise platform that ensures reliable electrical connections while accommodating the miniaturized dimensions, separating the functions that were previously combined in the lead frame.
3Productivity
If miniaturized diode chips are packaged with conventional lead frames, then production can proceed with existing methods, but distortion and failure occur due to inaccurate installation
Solution Approach 1:
The patent implements preliminary positioning actions by providing positioning holes in the circuit board and positioning pins on the chip before the actual bonding process. This preliminary alignment ensures that even miniaturized chips are placed with high precision, preventing distortion and failure while maintaining production efficiency.
Solution Approach 2:
The positioning mechanism serves as an intermediary that enables accurate chip placement without requiring complex adjustment during the bonding process itself. This intermediary positioning system maintains high productivity by preventing misalignment issues before they occur.
Data Source
AI summary
A miniaturized SMD diode package involves using a diode chip whose bottom surface has a positive electrode and a negative electrode, using a circuit board instead of a conventional lead frame during packaging, and using Charge-Coupled Device (CCD) image registration technology to perform chip bonding; the beneficial advantages brought from a process for producing the same including to simplify producing process and reduce manufacturing cost, to improve accuracy and precision of producing the miniaturized SMD diode package due to using a circuit board instead of conventionally used lead frame, and to ensure the produced miniaturized SMD diode package possesses excellent diode characteristics without distortion or defect.