SMD Diode Holder with Segmented LED and Anti-ESD Zones
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Solution Overview
Problem
The existing SMD diode packaging structures face issues with non-uniform brightness due to light reflection and absorption by the anti-ESD chip, unstable manufacturing processes leading to microdamage, silver glue overflow causing short circuits, and sealing compound deterioration at high temperatures, resulting in unreliable products and increased costs.
Innovation Solution
The SMD diode holding structure features a plastic housing with a concave function area and notch, where the LED chip is connected on the function area and the anti-ESD chip is placed in the notch, using conductive metal holders and sealing compounds to ensure uniform light reflection and prevent short circuits, while avoiding high-temperature damage to the sealing compounds and stabilizing the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the anti-ESD chip is placed on the holder with the LED chip, then ESD protection is provided, but light reflection and absorption occur causing non-uniform brightness
Solution Approach 1:
The holder is divided into two separate functional areas: a first surface with a first concave portion for mounting the LED chip, and a second surface with a second concave portion for mounting the anti-ESD chip. This spatial segmentation prevents the anti-ESD chip from interfering with the light path while maintaining ESD protection functionality.
Solution Approach 2:
The design transitions from a single-plane mounting structure to a dual-surface three-dimensional structure. By utilizing both the first surface and second surface of the holder, the patent creates separate optical and electrical functional zones, eliminating light interference while preserving ESD protection.
2Ease of manufacture
If the holder is punched or etched to form a concave portion, then the protective element can be fastened, but the holder vibrates during wiring causing microdamage
Solution Approach 1:
The patent introduces a damping structure within the concave portion that absorbs vibrations and shocks during the wiring process. This pre-established cushioning mechanism protects the LED chip and conductive wires from microdamage caused by holder vibration, while still allowing the protective element to be securely fastened.
3Strength
If too much conductive silver glue is applied, then the protective element is securely fastened, but the glue overflows causing short circuits
Solution Approach 1:
The concave portion is designed with specific geometric features including sidewalls and a bottom surface that create a contained space. This local structural quality allows the conductive silver glue to be securely applied for fastening the protective element while the concave geometry prevents overflow onto adjacent electrical components, eliminating short circuit risks.
4Productivity
If the molding element is molded at high temperature, then the holders and protective elements are packaged, but the sealing compound deteriorates
Solution Approach 1:
The patent separates the packaging process into two stages: first, the holders and protective elements are assembled at low temperature; second, only the LED chips and conductive wires are molded and sealed at high temperature. This segmentation allows the sealing compound to withstand high-temperature molding without deterioration, while the previously assembled components remain intact.
5Reliability
If the LED chip and anti-ESD chip are connected with conductive wires, then electrical connection is established, but the wiring process is complex and time-consuming
Solution Approach 1:
The patent combines multiple electrical connection functions into integrated conductive wire structures that simultaneously connect the LED chip to both metal holders and connect the anti-ESD chip to the metal holders. This merging of wiring paths reduces the number of separate connection operations required, simplifying the manufacturing process while ensuring reliable electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves uniform brightness, enhances manufacturing reliability, reduces costs, and allows for mass production by preventing microdamage and short circuits, while maintaining the effectiveness of the ESD protection and simplifying the manufacturing process.
Implementation Method 1
By exerting a voltage on the two metal holders, the LED chip 13 emits light
Implementation Method 2
The LED chip 13 and the two metal holders 11 are connected with two conductive wires 14
Implementation Method 3
In order to prevent the LED chip 13 from being damaged by static electricity, another metal holder 11 is connected with an anti-ESD chip 15
Data Source
AI summary
An SMD diode holding structure includes a plastic housing and a plurality of metal holders. Two ends of the plastic housing from a function area and a notch. The metal holder has a base portion and a connecting pin portion. The top and bottom surfaces of the base portion are exposed to the function area and the notch. The top surface of one base portion in the function area is connected with an LED chip, and the bottom surface of another base portion in the notch is connected with the anti-ESD chip. The LED chip, the anti-ESD chip, and the base portion are connected with a conductive wire. The function area is covered with a first sealing compound, and the notch is covered with a second sealing compound. Light emitted from the LED chip is uniformly reflected in the function area, and the brightness is uniform.