SMD-LED Mounting with Optical Detection for Circuit Carrier Precision
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for mounting surface-mount LEDs (SMD-LEDs) on circuit carriers suffer from high positioning inaccuracies due to component and carrier tolerances, particularly in angular and tilting positions, and are limited by lengthy processing times in silver sintering processes.
Innovation Solution
A process that compensates for these tolerances by detecting and aligning SMD-LEDs based on their light-emitting region, using precise optical detection and alignment techniques, and employing silver sintering or reflow soldering with an adhesive to achieve sub-50 μm accuracy, allowing for precise orientation and fixation of optical systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional Pick & Place and Reflow soldering processes are used, then the mounting process can be completed, but positioning accuracy deteriorates to ±110 μm or worse due to component tolerances and soldering process variations
Solution Approach 1:
The patent applies preliminary action by detecting the light-emitting region position of SMD-LED components before mounting, and using this detection information to calculate and compensate for positioning deviations. The system determines the actual position of the light-emitting region relative to the component body, then uses this information to adjust the mounting position, thereby compensating for component tolerances before the actual mounting occurs.
Solution Approach 2:
The patent implements feedback by using an optical detection system to measure the actual position of the light-emitting region, comparing it with the target position, and using this feedback information to adjust the mounting process. The system continuously monitors and adjusts the positioning based on detected deviations, enabling real-time correction of positioning errors.
2Manufacturing precision
If silver sintering processes are used for mounting, then mounting can be achieved, but processing time increases to more than 10 seconds
Solution Approach 1:
The patent applies parameter changes by transitioning from traditional silver sintering processes with long processing times to optimized soldering processes. The system adjusts soldering parameters such as temperature profiles, heating time, and adhesive curing conditions to achieve precise mounting within shorter time frames, thereby improving productivity while maintaining or enhancing mounting precision.
3Ease of manufacture
If Reflow soldering is used, then SMD-LED can be mounted, but additional positioning inaccuracies occur due to solder paste slumping and floating lift effects
Solution Approach 1:
The patent applies preliminary action by detecting the light-emitting region position before mounting and calculating compensation values in advance. This pre-detection and pre-calculation allows the system to anticipate and compensate for potential soldering-induced positioning errors before they occur, thereby maintaining high angular and tilting positional accuracy despite using Reflow soldering.
Solution Approach 2:
The patent replaces purely mechanical positioning methods with an optical detection and computational compensation system. Instead of relying solely on mechanical precision of the mounting equipment, the system uses optical sensors to detect light-emitting region positions and employs computational algorithms to calculate and apply positional corrections, thereby achieving higher precision despite mechanical tolerances and soldering variations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves positioning accuracy to below ±50 μm, reducing inaccuracies and processing time, enabling precise alignment and fixation of optical systems, even with less expensive components, by using advanced detection and alignment methods.
Implementation Method 1
Detection of the light-emitting region of the at least one SMD-LED can be effected for example by the use of an optical camera which detects the characteristic contour of the light-emitting region
Implementation Method 2
mounting of the at least one SMD-LED to the circuit carrier
Data Source
AI summary
The invention concerns a process for the production of a circuit carrier (1) equipped with at least one surface-mount LED (SMD-LED), wherein the at least one SMD-LED (2) is positioned in oriented relationship to one or more reference points (3) of the circuit carrier (1) on the circuit carrier (1), wherein the position of a light-emitting region (4) of the at least one SMD-LED (2) is optically detected in the SMD-LED (2) and the at least one SMD-LED (2) is mounted to the circuit carrier (1) in dependence on the detected position of the light-emitting region (4) of the at least one SMD-LED (2), and such a circuit carrier (1).