SMD LED Lighting Substrate with Fluorescent Layer for Glare Reduction

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Solution Overview

Problem

High-power LED lighting fixtures face issues with glare and multiple shadows due to individual LED elements emitting high-power light, and COB-type fixtures struggle with heat dissipation and wire breakage, limiting their high-power capabilities.

Innovation Solution

A lighting apparatus with a substrate featuring surface mount-type LED elements, a fluorescent substance layer, and an optional reflective layer to reduce glare and shadows, allowing for efficient light emission and heat dissipation without the need for extensive sealing or complex mounting facilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If individual LED elements are used to achieve high power, then power output is improved, but glare and multiple shadows occur

Engineering Contradiction:

Improvepower outputVSAvoidglare and multiple shadows

Core Design Contradiction:

PowerVSObject-affected harmful factors

Solution Approach 1:

The patent divides the lighting system into multiple independently mounted LED elements on a substrate, where each element can be separately positioned and controlled. This segmentation allows the light to be distributed more evenly across the substrate surface, reducing concentrated glare and multiple shadows while maintaining high total power output through the combined emission of multiple elements.

Inventive Principle:

Principle #1Segmentation

2Power

If COB-type elements are used to achieve single-device high power, then power concentration is improved, but heat dissipation becomes difficult

Engineering Contradiction:

Improvesingle-device powerVSAvoidheat dissipation

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

Instead of using a single COB element that concentrates heat in one location, the patent segments the high-power function across multiple individual LED elements mounted on a substrate. This distribution spreads the heat generation across multiple points, allowing better heat dissipation through the substrate structure and preventing excessive heat concentration that would occur with a single high-power COB element.

Inventive Principle:

Principle #1Segmentation

3Power

If flip chip-type LED elements are used for high power, then power output is improved, but junction leakage occurs during mounting

Engineering Contradiction:

Improvepower outputVSAvoidjunction leakage

Core Design Contradiction:

PowerVSReliability

Solution Approach 1:

The patent inverts the conventional mounting approach by using face-up type LED elements instead of flip chip-type elements. This inversion of the mounting orientation avoids the junction leakage problems that occur during flip chip mounting while still achieving high power output through the use of multiple high-power LED elements arranged on the substrate.

Inventive Principle:

Principle #13The other way round (Inversion)

4Use of energy by moving object

If reflective material is added to enhance light emission, then light efficiency is improved, but glare and multiple shadows are not sufficiently solved

Engineering Contradiction:

Improvelight emission efficiencyVSAvoidglare and multiple shadows

Core Design Contradiction:

Use of energy by moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent combines the use of reflective material with the segmented arrangement of multiple LED elements. The reflective material enhances light emission efficiency by redirecting light that would otherwise be lost, while the segmented distribution of multiple LED elements ensures that the enhanced light is spread evenly across the substrate, preventing concentrated glare and multiple shadows even with improved light efficiency.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces or prevents glare and multiple shadows while enabling high-power operation by utilizing a fluorescent substance layer to manage light emission and enhance heat dissipation, overcoming limitations of SMD and COB-type fixtures.

Implementation Method 1

the substrate includes a fluorescent substance layer containing a first fluorescent substance, the layer covering at least part of a surface on a side where the plurality of surface mount-type LED elements are mounted, the first fluorescent substance is excited at a wavelength of emitted light from at least one of the plurality of surface mount-type LED elements

Methodology Applied

Scientific EffectFluorescence: Fluorescence

Data Source

PatentUS11482646B2Lighting apparatus having mounting substrate for LED lighting

Publication Date: 2022.10.25 DENKA CO LTD

AI summary

Glare and/or multiple shadows are reduced and/or prevented in an SMD-type lighting fixture using high-power CSP devices. A lighting apparatus includes: a substrate having a plurality of conduction parts; and a plurality of surface mount-type LED elements mounted so as to be connected to the respective plurality of conduction parts which the substrate has, the individual elements being separately sealed, wherein the substrate includes a fluorescent substance layer containing a first fluorescent substance, the layer covering at least part of a surface on a side where the plurality of surface mount-type LED elements are mounted, the first fluorescent substance is excited at a wavelength of emitted light from at least one of the plurality of surface mount-type LED elements, and the plurality of surface mount-type LED elements are not integrally sealed.