Snorkel Conductive Path for Charged-Beam Semiconductor Failure Analysis
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Solution Overview
Problem
As semiconductor device designs become more complex, the accuracy of detecting defects in semiconductor devices worsens, making existing failure analysis methods less effective.
Innovation Solution
The implementation of a semiconductor device with a snorkel structure that includes a conductive structure, a conductive layer, and a topmost conductive layer buried in a dielectric layer, allowing for the transmission of output signals to a detectable location without direct contact, enabling charged-particle-beam based detection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor device design becomes more complex to achieve higher functionality, then device capability is improved, but defect detection accuracy deteriorates
Solution Approach 1:
The patent introduces an intermediary charged particle beam (electron beam) as a mediator between the detector and the output terminal. The beam interacts with electrons at the output terminal to generate detectable signals without requiring direct physical contact or invasive probing, thereby enabling accurate defect detection in complex devices while preserving device integrity
Solution Approach 2:
The patent replaces traditional mechanical contact-based detection methods with a charged particle beam-based detection system. Instead of using physical probes that make direct contact with the output terminal, the system uses an electron beam that can interact with electrons at the terminal through electromagnetic fields, eliminating the need for mechanical contact and enabling non-invasive detection in complex semiconductor structures
2Ease of operation
If traditional contact-based detection methods are used, then detection is straightforward, but device operation is disrupted and detection accuracy worsens in complex devices
Solution Approach 1:
The patent replaces mechanical contact-based detection with a charged particle beam system that uses electromagnetic interactions. The electron beam can detect signals without physical contact, maintaining detection simplicity while significantly improving accuracy in complex devices by avoiding the limitations of contact-based methods
3Device complexity
If direct contact detection is used, then detection method is simple, but device operation is disrupted and accuracy deteriorates
Solution Approach 1:
The charged particle beam serves as an intermediary that transfers information from the output terminal to the detector without requiring direct contact. This maintains simple detection methodology while improving reliability by eliminating disruptions caused by invasive probing
Solution Approach 2:
Replacing mechanical contact with charged particle beam interaction eliminates the disruption caused by physical probing, maintaining detection simplicity while significantly improving device operation stability during the detection process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy of defect detection in complex semiconductor devices by allowing for non-invasive, charged-particle-beam based analysis of output signals, thereby improving the reliability of failure analysis.
Implementation Method 1
The topmost conductive layer is configured to receive a charged particle beam and reflect the charged particle beam as a second charged particle beam having a different energy than the first charged particle beam based on the second electrical potential
Data Source
AI summary
The present disclosure provides a semiconductor device. The semiconductor device includes: a first cell, a dielectric layer, and a snorkel structure. The first cell has an output terminal. The dielectric layer is disposed on the first cell. The snorkel structure is disposed in the dielectric layer. The snorkel structure includes a first conductive structure, a first conductive layer, and a second conductive structure. The first conductive layer is electrically connected to the output terminal of the cell. The first conductive layer is disposed on and electrically connected to the first conductive structure. The second conductive structure is disposed on and electrically connected to the first conductive layer. The second conductive structure has a topmost conductive layer buried in the dielectric layer.