Semiconductor Optical Amplifier Geometry for LIDAR Efficiency

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Solution Overview

Problem

Current semiconductor optical amplifiers (SOAs) face efficiency degradation as output optical power increases, particularly in applications like LIDAR, where higher power is needed, and existing taper geometries do not maximize efficiency.

Innovation Solution

An SOA with a geometry that includes a taper with a decreasing slope and increasing width in the light propagation direction, optimized using an autoregressive model to determine slice widths that maximize conversion efficiency at given current densities, allowing for higher device efficiency and reduced power consumption.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If the width of SOA slices is increased to achieve higher output optical power, then the output power requirement is met, but the conversion efficiency degrades

Engineering Contradiction:
Improveoutput optical powerVSAvoidconversion efficiency
Core Design Contradiction:
PowerVSUse of energy by moving object

Solution Approach 1:

The SOA is divided into multiple slices along the light propagation direction, with each slice having a different width. This segmentation allows each slice to operate at its optimal width for maximum conversion efficiency while collectively achieving the required total output power through the cumulative effect of all slices.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different slices are assigned different widths optimized for their local operating conditions. The width of each slice is specifically tailored to maximize conversion efficiency at its particular position in the cascade, creating local optimization that translates to global performance improvement.

Inventive Principle:
Principle #3Local quality

2Device complexity

If the width of SOA slices is increased to reduce the number of slices needed, then device complexity is reduced, but conversion efficiency is compromised

Engineering Contradiction:
Improvenumber of slicesVSAvoidconversion efficiency
Core Design Contradiction:
Device complexityVSUse of energy by moving object

Solution Approach 1:

The device is segmented into multiple slices with progressively varying widths, creating a structured complexity that optimizes performance. This segmentation approach achieves better overall efficiency than fewer, uniformly wide slices by allowing each slice to operate in its optimal efficiency regime.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The slice widths follow a dynamic progression pattern (such as exponential or linear tapering) rather than being static and uniform. This dynamic variation in width along the propagation direction allows the device to adapt to changing optical power levels and maintain optimal efficiency across the entire operating range.

Inventive Principle:
Principle #15Dynamics

3Ease of manufacture

If uniform width slices are used, then manufacturing is simpler, but maximum conversion efficiency cannot be achieved

Engineering Contradiction:
Improvefabrication simplicityVSAvoidconversion efficiency
Core Design Contradiction:
Ease of manufactureVSUse of energy by moving object

Solution Approach 1:

The manufacturing process is extended to include local variation in slice widths, where each slice's width is specifically controlled to match its optimal efficiency requirement. This localized dimensional control, while adding some manufacturing complexity, enables the device to achieve maximum conversion efficiency that uniform-width designs cannot attain.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The width parameter is systematically varied across different slices according to an optimized progression pattern. This parameter change strategy transforms the static uniform-width design into a dynamic variable-width structure, enabling each slice to operate at its peak efficiency point and achieving superior overall performance.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS20230135027A1Geometry for a semiconductor optical amplifier
Publication Date: 2023.05.04 WELLS FARGO BANK NA
  • US20230135027A1 patent drawing
  • US20230135027A1 patent drawing
  • US20230135027A1 patent drawing

AI summary

In some implementations, a device may generate a data set including at least modal gain values and modal loss values for a semiconductor optical amplifier (SOA) slice. The device may determine, based on the data set, respective widths for a plurality of slices of an SOA using an autoregressive model. A width, of the respective widths, for a slice, of the plurality of slices, may be associated with a maximum conversion efficiency achievable for the slice at a given current density. The device may generate information indicating a geometry for the SOA based on the respective widths for the plurality of slices.