Socket-Integrated Joule Heating for Electronic Component Testing
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Solution Overview
Problem
Existing solutions for testing electronic components at elevated temperatures require bulky and complex heating structures, leading to high costs and inefficiencies, as they are not miniaturizable and require separate external resistance applications.
Innovation Solution
A compact heating device is inserted directly into the socket, utilizing electrically conductive materials like copper with integrated resistive paths for Joule heating, combined with a multi-layer structure and temperature monitoring, allowing for efficient heat production and distribution within the socket.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If bulky heating structures with separate resistance applications are used, then sufficient heat production is achieved, but device complexity and size increase significantly
Solution Approach 1:
The patent merges the heating function directly into the socket structure by integrating a resistive path within the conductive material that forms the socket itself, eliminating the need for separate heating devices and resistance applications. This integration reduces device complexity while maintaining sufficient heat production for temperature-dependent testing.
Solution Approach 2:
The socket structure serves multiple functions: it provides electrical connection, mechanical support, and heating capability. The conductive material with integrated resistance allows the same component to perform both signal transmission and heat generation, reducing the need for additional specialized heating equipment.
2Temperature
If separate heating cabinets are used, then temperature control is achieved, but cost and maintenance requirements increase
Solution Approach 1:
The heating function is merged into the socket structure itself through integrated resistive paths, eliminating the need for separate heating cabinets. This integration significantly reduces manufacturing costs and maintenance requirements while maintaining the ability to control temperature for testing electronic components.
3Power
If external heating devices are used, then sufficient heating power is achieved, but miniaturization becomes difficult
Solution Approach 1:
The heating function is merged into the socket structure at the component level, allowing sufficient heating power to be generated within a compact form factor. The integrated resistive path in the conductive material enables high power density without requiring bulky external heating devices, thus achieving miniaturization.
4Power
If bulky heating structures are used, then adequate heat generation is achieved, but portability and integration become problematic
Solution Approach 1:
The heating function is merged into the socket structure, creating a self-contained unit that is easy to integrate into testing systems. The integrated design eliminates the need for separate heating equipment, simplifying installation and operation while maintaining adequate heat generation capabilities for temperature-dependent component testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables low-cost, miniaturized, and cost-effective temperature testing of electronic components without the need for bulky ovens, with the ability to regulate and monitor temperature efficiently, reducing maintenance and complexity.
Implementation Method 1
The above-mentioned device is described in form of a slot in which the component to test has to be inserted and which is equipped with a heating element (235). Such heating element is able to produce heat thanks to the passage of current which takes place in an electric coil foreseen on it and such that, for Joule heating, the heating production is obtained.
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The present invention concerns a device (10) for heating an electronic component (200) to test inside a socket (2), said device being configured to result insertable inside the socket (2) and comprising a conductive material (25) and electric means (31, 33) so as to allow the passage of current to produce heat for Joule heating.