Socket Loading Mechanism with Bolster Plate for Thermal Management
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Solution Overview
Problem
High thermal resistances in package materials of chips, sockets, and printed circuit boards hinder effective heat dissipation in server packages, leading to increased thermal design power and mechanical stress, which limits chip performance and cooling efficiency.
Innovation Solution
The implementation of a loading mechanism that includes a bolster plate and a heat sink, with thermal bridges, vapor chambers, and heat pipes to enhance heat transfer and dissipation by thermally coupling the chip to the heat sink and dissipating heat through the bolster plate and back plate, utilizing thermal interface materials and optimized geometries to reduce thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional package materials and socket structures are used, then manufacturing simplicity is maintained, but thermal resistance increases and heat dissipation efficiency deteriorates
Solution Approach 1:
The socket structure is segmented into multiple functional components: a loading mechanism with bolster plate for mechanical support, thermal interface materials for heat transfer, and optional heat dissipation devices. This segmentation allows each component to be optimized independently for its specific function while maintaining overall thermal performance.
Solution Approach 2:
Thermal interface materials are introduced as intermediary substances between the IC package and heat dissipation structures. These materials mediate the heat transfer process by filling gaps and providing thermal pathways, significantly reducing thermal resistance at the interface without requiring complex structural modifications.
2Temperature
If additional cooling solutions are added at socket and board level, then heat dissipation efficiency improves, but device complexity increases
Solution Approach 1:
The loading mechanism is designed to serve multiple functions simultaneously: providing mechanical support for the IC package, establishing thermal pathways for heat dissipation, and enabling optional integration of heat dissipation devices. This multi-functionality reduces the need for separate dedicated cooling components, thereby limiting complexity increase.
Solution Approach 2:
The patent provides for optional heat dissipation devices that can be selectively implemented based on thermal requirements. The thermal interface materials and bolster plate structure provide baseline cooling capability, with additional heat dissipation devices added only when necessary to meet specific thermal design power requirements, avoiding unnecessary complexity.
3Temperature
If thermal interface materials and optimized geometries are used, then thermal resistance decreases, but manufacturing complexity increases
Solution Approach 1:
The patent specifies optimized geometries for the bolster plate and loading mechanism components, including dimensions and configurations that maximize thermal contact and heat transfer efficiency. These parameter optimizations are designed to be achievable through standard manufacturing processes, balancing thermal performance improvements with manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly improves heat dissipation from the interconnect plane, reducing thermal resistance and mechanical stress, enabling higher chip performance and cooling efficiency by effectively managing heat flow through the use of advanced thermal management components.
Implementation Method 1
a thermal interface material between the microprocessor socket and the bolster plate
Implementation Method 2
a heat dissipation device on the second surface of the bolster plate
Implementation Method 3
dissipating heat through the bolster plate and back plate
Data Source
AI summary
A microprocessor mounting apparatus comprising a microprocessor socket on a printed circuit board (PCB) and a bolster plate surrounding a perimeter of the microprocessor socket. The bolster plate has a first surface adjacent to the PCB, and a second surface opposite the first surface. A heat dissipation device is on the second surface of the bolster plate. The heat dissipation interface is thermally coupled to the microprocessor socket.