Socket Terminal Segmentation for High Current Contact Stability
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Solution Overview
Problem
The inspection process for semiconductor devices, particularly in DC/DC converters, faces issues with yield reduction and socket terminal service life due to the mode of connection between leads and socket terminals when high currents are supplied, leading to defective appearances and reduced service life.
Innovation Solution
A semiconductor device manufacturing method that includes a socket terminal with a main body, a support portion, a plate-like portion, and multiple projecting portions to facilitate a stable and dispersed current path, reducing temperature increases and preventing solder oxidation and whisker formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional socket terminal is used to supply high current to the lead, then the electrical connection is established, but the service life of the socket terminal is reduced and yield decreases due to temperature increase and solder oxidation
Solution Approach 1:
The socket terminal is divided into multiple contact portions (first contact portion and second contact portion) instead of a single contact point. This segmentation distributes the current flow across multiple paths, reducing the current density and resulting temperature increase at each individual contact portion, thereby extending the service life of the socket terminal and improving yield by preventing solder oxidation
Solution Approach 2:
The invention transitions from a single-point contact configuration to a multi-point contact configuration, adding spatial distribution in another dimension. By arranging multiple contact portions at different locations on the lead, the current path is expanded from a concentrated point to a distributed pattern, effectively reducing thermal concentration and preventing solder oxidation at any single location
2Productivity
If high current is supplied through a single contact portion, then the electrical characteristic inspection can be performed, but solder oxidation and whisker formation occur leading to defective appearance
Solution Approach 1:
The current path is segmented into multiple parallel paths through the first and second contact portions. This segmentation allows the high current to be distributed across multiple contact points, preventing the concentration of thermal energy that causes solder oxidation and whisker formation, while still enabling efficient electrical characteristic inspection
Solution Approach 2:
Different contact portions are positioned at specific locations on the lead to create localized current distribution. By strategically placing multiple contact portions, the invention creates favorable local conditions at each contact point, reducing the likelihood of solder oxidation and whisker formation in any specific location while maintaining overall inspection efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the yield of semiconductor devices and extends the service life of socket terminals by stabilizing contact resistance and reducing Joule heat, preventing defects and service life reduction.
Implementation Method 1
current is caused to flow from the socket terminal to the lead... the amount of current to be supplied increases... reduction in service life of the socket terminal are brought out depending on a mode of connection
Data Source
AI summary
Improvement in yield of a semiconductor device is obtained. In addition, increase in service life of a socket terminal is obtained. A projecting portion PJ1 and a projecting portion PJ2 are provided in an end portion PU of a socket terminal STE1. Thus, it is possible to enable contact between a lead and the socket terminal STE in which a large current is caused to flow, at two points by a contact using the projecting portion PJ1 and by a contact using the projecting portion PJ2, for example. As a result, the current flowing from the socket terminal STE1 to the lead flows by being dispersed into a path flowing in the projecting portion PJ1 and a path flowing in the projecting portion PJ2. Accordingly, it is possible to suppress increase of temperature of a contact portion between the socket terminal STE1 and the lead even in a case where the large current is caused to flow between the socket terminal STE1 and the lead.