SOI MEMS Switch Module With Integrated Diode to Cut Parasitics

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Solution Overview

Problem

MEMS switches in electronic modules are typically built on separate substrates, leading to high construction costs, space requirements, and parasitic inductances, capacitances, and line resistances that hinder efficient operation.

Innovation Solution

Integrate semiconductor components, such as diodes, directly onto the substrate of MEMS switches using silicon-on-insulator wafers, eliminating the need for external connections and reducing parasitic effects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If MEMS switches are built on separate substrates, then the switching function is achieved, but construction costs increase and space requirements increase

Engineering Contradiction:

Improveswitching functionVSAvoidconstruction cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines the MEMS switch and semiconductor component onto a single substrate, eliminating the need for separate substrates and reducing construction costs while maintaining the switching function

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If MEMS switches are built on separate substrates, then the switching function is achieved, but space requirements increase

Engineering Contradiction:

Improveswitching functionVSAvoidspace requirement

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent merges the MEMS switch and semiconductor component onto one substrate, significantly reducing the overall space requirement while preserving the switching function

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If external connections are used to connect MEMS switches to semiconductor components, then the switching function is achieved, but parasitic inductances, capacitances and line resistances increase

Engineering Contradiction:

Improveswitching functionVSAvoidparasitic inductances, capacitances and line resistances

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent integrates the MEMS switch and semiconductor component on the same substrate with direct electrical connection, eliminating external connection lines and thereby removing parasitic inductances, capacitances and line resistances

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts and eliminates the external connection infrastructure, removing the source of parasitic effects from the system

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This integration results in lower costs, reduced space requirements, and improved operational efficiency by simplifying connections and preventing parasitic inductances, capacitances, and line resistances.

Implementation Method 1

the substrate is formed from or with a silicon-on-insulator-wafer and/or silicon-on-insulator substrate

Methodology Applied

Scientific EffectSilicon-on-insulator:

Implementation Method 2

the at least one semiconductor component (270) is formed by doping the substrate (120)

Methodology Applied

Scientific EffectSemiconductor doping: Dopants

Implementation Method 3

the electrical connection of the MEMS switches to another part of the circuit regularly results in parasitic inductances, capacitances and line resistances

Methodology Applied

Scientific EffectParasitic capacitance: Parasitic Capacitance

Data Source

PatentUS12580144B2Electronic module

Publication Date: 2026.03.17 ROBERT BOSCH GMBH

AI summary

Various embodiments of the teachings herein include an electronic module comprising a microelectromechanical system (MEMS) switch with a substrate and a semiconductor component. The semiconductor component is formed with the substrate and connected to MEMS switch. The semiconductor component includes a diode. The substrate is formed from or with a silicon-on-insulator-wafer and/or silicon-on-insulator substrate.