SOI Transistor Back-Gate Modulation for Dynamic Speed and Leakage Control

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Solution Overview

Problem

Modern integrated circuits face challenges in dynamically adjusting transistor performance characteristics, such as threshold voltage and leakage current, due to limitations in existing body-biasing techniques which either enhance performance at the cost of increased leakage or reduce leakage at the expense of performance, without flexible on-demand modulation.

Innovation Solution

The integration of a counter-doped back-gate region and contact region in an SOI substrate, laterally separated by a doped base semiconductor substrate, allows for individual modulation of transistor performance characteristics by applying voltages to the back-gate, enabling dynamic adjustment of threshold voltage and switching speed while managing leakage current.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If forward back-bias is applied to enhance drive current and performance, then speed is improved, but leakage current increases

Engineering Contradiction:
Improvetransistor switching speedVSAvoidleakage current
Core Design Contradiction:
SpeedVSObject-generated harmful factors

Solution Approach 1:

The patent implements dynamic back-biasing control where the back-gate voltage can be adjusted in real-time based on operational requirements. The circuit can switch between different biasing states (forward back-bias for speed, reverse back-bias for low leakage) depending on whether peak performance or power conservation is needed, making the transistor characteristics adaptable rather than fixed

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the electrical parameters of the transistor by applying variable voltages to the back-gate terminal. By modulating the back-gate voltage parameter, the threshold voltage and channel conductivity are dynamically adjusted, enabling the transistor to operate in different regimes (high-speed mode with higher leakage vs. low-leakage mode with reduced speed)

Inventive Principle:
Principle #35Parameter changes

2Loss of energy

If reverse back-bias is applied to reduce leakage current, then power consumption is reduced, but performance decreases

Engineering Contradiction:
Improvepower consumptionVSAvoidtransistor switching speed
Core Design Contradiction:
Loss of energyVSSpeed

Solution Approach 1:

The system dynamically switches between reverse back-bias (for low power) and forward back-bias (for high performance) based on operational demands. The back-gate voltage is controlled to be negative during power-saving modes and can be switched to positive or less negative values when speed is required, enabling adaptive power-performance optimization

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The back-biasing is applied periodically or intermittently based on workload requirements rather than continuously. The circuit can alternate between active high-performance states and idle low-power states, applying the appropriate biasing regime at the right times to optimize overall energy efficiency while maintaining performance when needed

Inventive Principle:
Principle #19Periodic action

3Adaptability or versatility

If body-biasing is used to dynamically adjust threshold voltage, then adaptability is improved, but device complexity increases

Engineering Contradiction:
Improvetransistor performance modulationVSAvoidgate structure complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent adds a fourth terminal (back-gate) to the traditional three-terminal transistor structure, extending control from the channel region to the substrate region beneath the channel. This dimensional extension allows independent control of threshold voltage through the back-gate while maintaining the original front-gate control, providing dual-control capability without fundamentally complicating the core transistor operation

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The back-gate structure serves multiple functions: it controls threshold voltage, modulates channel conductivity, enables dynamic biasing, and can be used for both NFET and PFET devices using the same structural approach. The counter-doped region provides universal functionality across different transistor types and application scenarios

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution provides systems designers with the ability to alter transistor performance on-demand, optimizing speed and power consumption based on operational needs, by turning the back-gate on for faster processing during peak demand and off for power conservation.

Implementation Method 1

Such body-biasing changes the electrostatic control of the transistors and shifts the threshold voltage (VTH) of the device

Methodology Applied
Scientific EffectElectrostatic control: Electrostatics

Implementation Method 2

The transistors are typically either NFET or PFET type devices wherein the 'N' and 'P' designation is based upon the type of dopants used to create the source/drain regions of the devices

Methodology Applied
Scientific EffectElectrical field: Electric Field

Data Source

PatentUS11398555B2Transistor device with a plurality of active gates that can be individually modulated to change performance characteristics of the transistor
Publication Date: 2022.07.26 GLOBALFOUNDRIES US INC
  • US11398555B2 patent drawing
  • US11398555B2 patent drawing
  • US11398555B2 patent drawing

AI summary

One illustrative device disclosed herein includes a gate structure positioned above an active semiconductor layer of an SOI substrate and a counter-doped back-gate region positioned in the doped base semiconductor substrate of the SOI substrate. In this particular embodiment, the device also includes a counter-doped back-gate contact region positioned in the base semiconductor substrate, wherein the counter-doped back-gate region and the counter-doped back-gate contact region are doped with a dopant type that is opposite the dopant type in the base semiconductor substrate. In this illustrative example, the counter-doped back-gate region and the counter-doped back-gate contact region are laterally separated from one another by a portion of the doped base semiconductor substrate. The device also includes a conductive back-gate contact structure that is conductively coupled to the counter-doped back-gate contact region.