Solar Cell CMOS Image Sensor Integration for Self-Powered Fabrication
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Solution Overview
Problem
Existing image sensor structures, such as CMOS image sensors, require additional processing steps to remove the support carrier, complicating the fabrication process and increasing production costs.
Innovation Solution
Integrate a CMOS image sensor array with a solar cell, utilizing the solar cell as a support substrate and power supply, where direct current voltage generated by the solar cell is stored in a metal-insulator-metal capacitor and converted into alternating current signals to power the image sensor array.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a support carrier is used for the image sensor array, then the image sensor can be fabricated and handled, but additional processing steps are required to remove the support carrier
Solution Approach 1:
The patent merges the support carrier function with a solar cell, combining two separate components (support carrier and power source) into a single integrated structure. The solar cell serves dual purposes: providing mechanical support during fabrication and generating power for the image sensor, thereby eliminating the need for separate support carrier removal steps
Solution Approach 2:
The solar cell is designed to perform multiple functions simultaneously: it acts as a support substrate during fabrication, provides structural support in the final device, and serves as a power source for the image sensor. This multi-functionality eliminates the need for dedicated support carrier removal processes
2Ease of manufacture
If a support carrier is used for the image sensor array, then the image sensor can be fabricated and handled, but production costs increase due to additional processing steps
Solution Approach 1:
By combining the support carrier and power source into a single solar cell component, the patent eliminates the need for separate support carrier removal steps, thereby reducing production costs associated with additional processing
Solution Approach 2:
The solar cell serves itself by providing both mechanical support and electrical power to the image sensor, eliminating the need for external power sources and reducing overall system complexity and cost
3Reliability
If the image sensor array is integrated with a solar cell, then a stable power supply is provided, but the device structure becomes more complex
Solution Approach 1:
The solar cell is designed to perform multiple functions simultaneously: it acts as a support substrate during fabrication, provides structural support in the final device, and serves as a power source for the image sensor. This multi-functionality eliminates the need for dedicated support carrier removal processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of a solar cell with the image sensor array forms a self-sufficient package that simplifies fabrication, reduces production costs, and provides a stable power supply for the image sensor.
Implementation Method 1
a solar cell, wherein the substrate of the solar cell serves as a support substrate for the CMOS image sensor array during fabrication of the CMOS image sensor array, and the solar cell forms a self-sufficient package and provides a stable power supply for the CMOS image sensor array
Implementation Method 2
direct current voltage generated by the solar cell is stored in a metal-insulator-metal capacitor
Data Source
AI summary
The present disclosure provides an integrated circuit (IC) structure with a solar cell and an image sensor array. An integrated structure according to the present disclosure includes a first substrate including a plurality of photodiodes, an interconnect structure disposed on the first substrate, a first bonding layer disposed on the interconnect structure, a second bonding layer disposed on the first bonding layer, a second substrate disposed on the second bonding layer, and a transparent conductive oxide layer disposed on the second substrate.