Contactless PCB-Antenna Transition Using Solder-Ball EBG Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Achieving a low loss transition between a PCB and an antenna module while preventing electromagnetic signal leakage is challenging, which can damage or interfere with surrounding equipment.
Innovation Solution
A contactless interconnection using solder balls on the PCB forms an electromagnetic band gap (EBG) structure with the antenna module, allowing for efficient signal transmission without direct electrical contact, reducing manufacturing errors and assembly complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If direct electrical contact is made between PCB and antenna module to achieve good electrical contact, then transition loss is reduced, but manufacturing precision and assembly complexity increase due to the need for precise alignment and sealing
Solution Approach 1:
The patent introduces an electromagnetic band gap (EBG) structure as an intermediary between the PCB and antenna module. This EBG structure, formed by solder balls arranged in a specific pattern, acts as a mediator that enables electromagnetic coupling without requiring direct physical contact. The solder balls create a periodic structure that guides electromagnetic waves from the PCB to the antenna module through the gap, eliminating the need for precise sealing and direct contact while maintaining low transition loss.
2Reliability
If direct electrical contact is made between PCB and antenna module, then electrical connection is improved, but assembly ease and tolerance for manufacturing errors decrease
Solution Approach 1:
The patent replaces the mechanical contact-based electrical connection system with an electromagnetic field-based system. Instead of relying on physical contact between metal surfaces, the invention uses the EBG structure to establish electromagnetic coupling between the PCB and antenna module. This substitution allows the components to be connected through electromagnetic waves passing through the gap, significantly easing assembly requirements and increasing tolerance for manufacturing variations.
3Productivity
If electromagnetic signals are transmitted through a transition interface, then signal transmission is achieved, but electromagnetic signal leakage occurs which can damage or interfere with surrounding equipment
Solution Approach 1:
The patent segments the transition interface into multiple discrete solder balls arranged in a periodic pattern, forming the EBG structure. This segmentation creates multiple small apertures rather than a continuous opening, which effectively suppresses electromagnetic leakage while maintaining signal transmission. The periodic arrangement of solder balls creates bandgap frequencies that block unwanted electromagnetic waves, preventing signal leakage into surrounding areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves low loss and low leakage transitions, enabling easier assembly and tolerance for manufacturing errors, while maintaining excellent transition performance and reducing electromagnetic interference.
Implementation Method 1
The solder balls are arranged to form an electromagnetic band gap, EBG, structure together with the conductive second major surface of the antenna module and the conductive layer of the first major surface of the PCB, and wherein the EBG structure delimits a waveguiding space
Implementation Method 2
the EBG structure delimits a waveguiding space
Implementation Method 3
The first major surface comprises at least one antenna aperture communicating with the waveguide opening for transmitting or receiving electromagnetic waves of an operation wavelength λ
Data Source
Figure 1~2
Figure 3a~3b
Figure 4a~6a
AI summary
The present disclosure relates to an antenna arrangement (10) comprising a PCB (1) a plurality of solder balls (16) soldered on the first major surface (1a) of the PCB (1), the PCB (1) further comprising a conductive layer (12a) connecting the solder balls (16) at their bases. The antenna arrangement further comprises an antenna module (2) comprising a second major surface (2b) which is electrically conductive and at least one waveguide opening (23) and at least one antenna aperture (22), wherein the antenna module (2) is arranged with the second major surface (2b) facing the PCB (1). The solder balls (16) are arranged to form an EBG structure together with the conductive second major surface (2b) of the antenna module (2) and the conductive layer of the first major surface (1a) of the PCB (1), and the antenna arrangement (10) further comprises a transmitting and/or receiving component (3).