Solder Ball Bonding Strength Testing Device
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Solution Overview
Problem
Conventional bonding strength testing devices for solder balls lack accuracy in measuring the largest impact force, continuous impact duration, and ductility due to poor sensitivity and separation distance between stress sensors and the solder ball, resulting in an incomplete profile of the impact response.
Innovation Solution
A bonding strength testing device equipped with a fixed base, an impact apparatus, a displacement sensor, and a stress sensor, where the impact apparatus slides through a through hole with position limiting structures and a buffering element, allowing for precise measurement of stress and displacement to determine the maximum impact force, continuous impact duration, and ductility of the solder ball.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the stress sensor is separated from the solder ball by a relatively large distance, then the device structure is simpler, but the measurement precision deteriorates
Solution Approach 1:
The patent introduces an impact apparatus as an intermediary component that transmits the impact force from the solder ball to the stress sensor. The stress sensor measures the reaction force on the impact apparatus rather than directly on the solder ball, enabling accurate measurement while maintaining a practical separation distance for device construction.
2Ease of operation
If conventional testing methods are used, then the testing process is simpler, but the measurement precision of impact force profile deteriorates
Solution Approach 1:
The patent implements a feedback mechanism where the stress sensor continuously measures the reaction force during impact and provides real-time data about the impact force profile. This feedback enables precise measurement of maximum impact force, continuous impact duration, and ductility, transforming the testing process from simple to precisely controlled and measured.
3Ease of operation
If the impact apparatus is allowed to move freely, then the ease of operation is improved, but the measurement precision deteriorates due to uncontrolled movement
Solution Approach 1:
The patent employs dynamic position limiting structures that allow the impact apparatus to move freely during the impact process while preventing excessive movement after impact. The position limiting structures are designed to constrain the apparatus only when necessary, maintaining ease of operation during testing while ensuring measurement precision through controlled movement boundaries.
Data Source
AI summary
A bonding strength test device suits to perform a bonding strength test for at least one solder ball that fixed on a substrate. The bonding strength test device includes a fixed base and an impact apparatus. The impact apparatus has a first end and a second end corresponding to the first end. While an impact is applied to the first end of the impact apparatus, the impact apparatus moves downward, and the second end of the impact apparatus hits the solder ball on the substrate for performing the bonding strength test. Besides, the fixed base is used for limiting the downward movement of the impact apparatus.