Solder Supply Device Internal Piston Pressure Mechanism
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Solution Overview
Problem
Existing solder supply devices require complex construction and increased space due to the need for air cylinders or electromagnetic motors to increase pressure for solder dispensing, making them bulky and costly.
Innovation Solution
A solder supply device that uses a piston and air chamber mechanism within the solder container to increase pressure internally, eliminating the need for external air cylinders or electromagnetic motors, allowing for compact design and simplified construction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an air cylinder or electromagnetic motor is used to increase pressure inside the solder container, then solder can be supplied effectively, but the device construction becomes complex and the device size increases
Solution Approach 1:
The patent combines the pressure generation function directly into the solder container by integrating a piston mechanism that moves relative to the container. The container body itself becomes part of the pressure generation system, eliminating the need for separate air cylinders or electromagnetic motors. This merging of functions reduces construction complexity while maintaining solder supply capability.
Solution Approach 2:
The piston is positioned inside the solder container, with the piston rod extending through the container wall. The air chamber is nested within the container structure, with the piston moving within the container's internal space. This nested arrangement eliminates external pressure-generating components and reduces overall device size.
2Reliability
If an air cylinder or electromagnetic motor is provided to increase pressure, then solder supply is achieved, but the device occupies more space
Solution Approach 1:
The piston mechanism is nested within the solder container, with the piston moving inside the container's internal volume. The air chamber is integrated into the container structure, utilizing the container's own space for pressure generation. This eliminates the need for external air cylinders or motors, significantly reducing the device's overall volume.
Solution Approach 2:
The pressure generation system is merged with the solder container structure itself. The container body serves dual purposes: holding solder and providing the chamber for the piston mechanism. This integration eliminates separate pressure-generating components and reduces the total device volume.
3Reliability
If external pressure-increasing components are used, then solder can be dispensed, but the construction becomes more costly
Solution Approach 1:
The patent merges the pressure generation function into the solder container structure, eliminating the need for separate air cylinders or electromagnetic motors. This integration reduces the number of components that need to be manufactured and assembled, thereby reducing manufacturing costs while maintaining solder dispensing functionality.
Solution Approach 2:
The invention extracts and eliminates the complex and costly external pressure-generating components (air cylinders or electromagnetic motors) by replacing them with a simpler integrated piston mechanism. This extraction of unnecessary components reduces manufacturing complexity and cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and compact solder dispensing without the need for external pressure-increasing components, reducing complexity and cost while maintaining effective solder supply functionality.
Implementation Method 1
solder is supplied from the tip of the nozzle by relatively moving the solder container and the piston by air being supplied to the air chamber
Data Source
AI summary
Solder supply device 26 is provided with solder cup 70 housing liquid solder that is tubular and open at one end; nozzle section 88, for ejecting solder from the solder container, that is inserted into the solder container; flange section 90 that is provided on an outer circumferential section of the nozzle section and that is engaged inside of the solder cup; and outer tube 72 that demarcates an air chamber with the bottom surface of the solder cup. Solder is supplied from the tip of the nozzle section by the solder cup and the flange section being relatively moved by supplying air to the air chamber. According to the present invention of a solder supply device, solder is supplied from a solder container without using an air cylinder, electromagnetic motor, or the like.