Solder Paste Position Control for Self-Aligned Component Mounting
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Solution Overview
Problem
Conventional electronic component mounting processes face challenges in ensuring accurate positional alignment due to the self-alignment effect of molten solder, leading to potential offset and bonding failures, as existing inspection criteria are unclear and do not effectively account for displacements caused by the solder's surface tension.
Innovation Solution
A component-mounted board production apparatus and method that includes a solder set-position measuring device, electronic component placement device, placement-position decision device, bonding device, and mounting-position decision device, utilizing a solder set-position measuring device to calculate the center of volume of solder distribution for precise placement and bonding, ensuring conformity to the board-side electrode position before and after solder reflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If electronic component placement references the design-base mounting reference position, then electrode alignment is improved, but mounting position accuracy deteriorates due to solder paste offset and self-alignment effect
Solution Approach 1:
The patent measures the solder paste print position before component placement and uses this information to calculate a corrected placement position. This preliminary measurement and calculation enable the system to anticipate and compensate for the self-alignment effect that will occur during reflow, thereby maintaining mounting position accuracy while still achieving proper electrode alignment through the self-alignment mechanism
Solution Approach 2:
The patent implements a feedback mechanism where the actual solder paste print position is measured and used to adjust the component placement position. This closed-loop control ensures that the placement position is dynamically corrected based on actual solder paste conditions, compensating for offsets and predicting the final mounting position after self-alignment occurs
2Manufacturing precision
If inspection uses board-side electrode position as criterion, then electrode alignment is measured, but mounting position accuracy deteriorates due to displacement from self-alignment effect
Solution Approach 1:
The patent implements a feedback mechanism where the actual solder paste print position is measured and used to adjust the component placement position. This closed-loop control ensures that the placement position is dynamically corrected based on actual solder paste conditions, compensating for offsets and predicting the final mounting position after self-alignment occurs
Solution Approach 2:
The patent changes the inspection criterion from fixed board-side electrode position to a dynamic reference that accounts for solder paste print position and predicted self-alignment displacement. By adjusting the reference parameter based on measured solder paste characteristics, the inspection system can accurately evaluate both electrode alignment and mounting position
3Measurement precision
If inspection uses solder print position as criterion, then placement position consistency is measured, but mounting position accuracy deteriorates due to displacement from self-alignment effect
Solution Approach 1:
The patent implements a feedback mechanism where the actual solder paste print position is measured and used to adjust the component placement position. This closed-loop control ensures that the placement position is dynamically corrected based on actual solder paste conditions, compensating for offsets and predicting the final mounting position after self-alignment occurs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective position control of electronic components, improving mounting quality by accurately determining and correcting the placement and mounting positions, utilizing the self-alignment effect of molten solder while ensuring proper bonding and alignment.
Implementation Method 1
due to surface tension by the reflowing molten solder
Implementation Method 2
solder reflowing is performed so that the component-side electrodes will get wet with the molten solder
Data Source
AI summary
The electronic component mounting line includes a computing unit for calculating a print position of solder paste printed on board-side electrodes, an electronic component placement device for placing an electronic component onto the board-side electrodes by referencing the print position of the solder paste, a placement position control device for controlling the placement position of the electronic component by referencing the print position of the solder paste, a bonding device for melting the solder paste to bond the electronic component and the board-side electrodes to each other, and a mounting-position control device for controlling the mounting position of the electronic component by referencing the board-side electrode position. In this configuration, position control responsive to displacement of the electronic component by the self alignment effect exerted by the molten solder paste is fulfilled.