Solder Resist Layer UV Transparency for Mark Display
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for manufacturing substrates with solder resist layers require multiple processes, including ink layer formation, exposure, development, and heating, which are cumbersome and inefficient for displaying letters or marks.
Innovation Solution
A method involving the application of a solder resist ink mixture of epoxy-based and acrylic-based resins on a substrate, where specific portions are irradiated with controlled ultraviolet light to create transparent and opaque areas, allowing for direct display without additional ink layers or extensive processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an ink layer is formed on the solder resist layer followed by exposure, development, and heating processes to display letters or marks, then the substrate can display information, but the manufacturing process becomes complex and troublesome with many steps
Solution Approach 1:
The patent combines the information display function with the solder resist layer itself. By forming a transparent pattern directly in the solder resist layer through controlled UV irradiation, the need for separate ink layers, exposure, development, and heating processes is eliminated. The solder resist layer serves dual purposes: protecting circuit patterns and displaying letters or marks.
Solution Approach 2:
The solder resist layer is given multiple functions simultaneously. It acts as both a protective coating for the circuit board and a display medium for letters or marks. This multi-functionality removes the need for additional dedicated layers and processes for information display.
2Loss of information
If multiple processes including ink layer formation, exposure, development, and heating are used to display letters or marks, then information can be displayed on the substrate, but the manufacturing becomes very troublesome
Solution Approach 1:
The patent merges the information display function into the solder resist layer formation process. By using a photomask during the UV curing process to create transparent patterns, letters or marks are formed directly in the solder resist layer, eliminating the need for separate ink application, exposure, and development steps.
Solution Approach 2:
The information display pattern is created during the initial UV curing process of the solder resist layer. By placing a photomask at this stage, the transparent pattern is formed simultaneously with the hardening of the solder resist, rather than requiring subsequent separate processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the number of manufacturing steps, maintains transparency for display, and allows for clear visualization of letters or marks without ink layer processing, using existing equipment and minimizing waste.
Implementation Method 1
irradiating a predetermined portion of the solder resist layer with ultraviolet rays and controlling an amount of irradiation of the ultraviolet rays irradiated to the predetermined portion of the solder resist layer to form the predetermined portion in transmissivity that transmits light
Data Source
AI summary
A method of manufacturing a substrate includes applying solder resist ink containing a mixing resin of epoxy-based resin and acrylic-based resin on at least one surface of a substrate body to form a solder resist layer, and irradiating a predetermined portion of the solder resist layer with ultraviolet rays and controlling an amount of irradiation of the ultraviolet rays irradiated to the predetermined of the solder resist layer to form the predetermined portion in transmissivity that transmits light.