Solder Support Structure for Deformation-Free Semiconductor Bonding

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Solution Overview

Problem

Existing semiconductor packages face challenges in achieving miniaturization, reduced weight, increased performance, capacity, and reliability, particularly in stacked semiconductor chip configurations, due to issues such as deformation and short-circuiting during bonding processes.

Innovation Solution

The semiconductor package incorporates a pad structure with a conductive support surrounding the solder, where the conductive support has a higher melting point than the solder, preventing deformation and short-circuiting by acting as a dam during thermocompression bonding, and minimizing joint gaps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a pad structure with wider solder is used to improve bonding reliability, then the bonding strength is improved, but the pad structure becomes more prone to deformation and short-circuiting during thermocompression bonding

Engineering Contradiction:

Improvebonding reliabilityVSAvoiddeformation and short-circuiting

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies different material properties to different regions of the pad structure. The conductive support is made of a material with higher melting point than the solder, creating local property differentiation. This allows the solder region to provide bonding reliability while the conductive support region prevents deformation and short-circuiting during thermocompression bonding.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The conductive support acts as an intermediary structure between the solder and the surrounding environment. It provides mechanical support and thermal management during the bonding process, preventing the solder from deforming excessively or causing short-circuits while maintaining the electrical connection functionality.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If the solder joint is enlarged to reduce joint gaps, then the electrical connection is improved, but the risk of short-circuiting between adjacent pads increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidshort-circuiting risk

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The conductive support provides localized electrical isolation around the solder joint. By controlling the geometry and material properties of the conductive support, the patent enables larger solder joints for better electrical connection while preventing adjacent pads from short-circuiting through the controlled resistance and physical separation provided by the conductive support structure.

Inventive Principle:

Principle #3Local quality

3Reliability

If thermocompression bonding is performed at high temperature to improve bonding strength, then the bonding reliability is improved, but the solder becomes more prone to deformation due to exceeding its melting point

Engineering Contradiction:

Improvebonding strengthVSAvoidsolder deformation

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent changes the material parameter (melting point) of the conductive support to be higher than that of the solder. This allows the bonding process to be performed at temperatures that melt the solder for strong bonding while the conductive support remains solid and provides structural stability, preventing solder deformation.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The conductive support structure is designed beforehand to provide mechanical cushioning and constraint to the solder during the high-temperature bonding process. This pre-established structural support prevents the solder from deforming excessively when exposed to temperatures above its melting point.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the reliability and yield of semiconductor packages by preventing cracks and warpage, ensuring secure insulation and reducing joint gaps between pad structures.

Implementation Method 1

A melting point of the conductive support is higher than a melting point of the solder

Methodology Applied

Scientific EffectMelting point difference: Melting

Data Source

PatentUS12575463B2Semiconductor device comprising a solder support to prevent deformation during bonding

Publication Date: 2026.03.10 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package is provided. The semiconductor package includes a first structure with a first insulating layer and a connection pad which penetrates through the first insulating layer; and a second structure with a second insulating layer bonded to the first insulating layer and a pad structure provided in a recess portion of the second insulating layer. The pad structure is bonded to and wider than the connection pad. The pad structure includes: an electrode pad disposed on a bottom surface of the recess portion; a solder disposed on the electrode pad and bonded to the connection pad; and a conductive support disposed to surround a side surface of the solder on the electrode pad and bonded to the first insulating layer. A melting point of the conductive support is higher than a melting point of the solder.