Soldered Connection Temperature Detection Emissivity Control
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Solution Overview
Problem
Existing methods for increasing the emissivity of temperature measurement zones for accurate temperature detection in soldering processes, such as lacquer coating or adhesive bonding, often result in non-uniformity, health hazards, and adverse effects on electrical properties, particularly in high-frequency applications.
Innovation Solution
Locally heating the temperature measurement zone to increase its emissivity through oxidation or vaporization of a thin surface layer, without applying additional materials, allowing for precise temperature detection and reliable soldering processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If lacquer is applied to the temperature measurement zone to increase emissivity, then temperature detection accuracy is improved, but manufacturing complexity and health hazards increase due to drying time and solvent vapour requirements
Solution Approach 1:
The patent extracts and eliminates the lacquer coating step from the manufacturing process. Instead of applying an external substance to increase emissivity, the invention uses the natural emissivity of the metal surface or applies a thin oxide layer through controlled oxidation, thereby removing the complexity of drying times and solvent vapour management while maintaining temperature detection accuracy
Solution Approach 2:
The invention enables the temperature measurement zone to serve itself by utilizing the natural emissivity properties of the metal surface or by allowing controlled oxidation to occur during the soldering process itself, eliminating the need for external lacquer application and drying steps
2Measurement precision
If lacquer is applied to the temperature measurement zone to increase emissivity, then temperature detection accuracy is improved, but electrical properties deteriorate due to passive intermodulation effects
Solution Approach 1:
The patent removes the lacquer coating that causes passive intermodulation effects. By using the natural metal surface or a thin oxide layer instead, the invention eliminates the harmful electrical interference while preserving sufficient emissivity for accurate temperature detection in high-frequency applications
Solution Approach 2:
The invention applies the emissivity enhancement only to the specific temperature measurement zone through controlled oxidation, rather than coating the entire component with lacquer. This localized approach maintains electrical properties in other areas while providing sufficient thermal radiation detection capability at the measurement point
3Measurement precision
If lacquer is applied to the temperature measurement zone to increase emissivity, then temperature detection accuracy is improved, but manufacturing precision decreases due to non-uniform coating thickness
Solution Approach 1:
The patent eliminates the lacquer coating process entirely, replacing it with methods that produce uniform emissivity enhancement without the variability of manual or automated coating applications. Controlled oxidation or use of the natural metal surface ensures consistent thermal radiation properties
Solution Approach 2:
The invention allows the temperature measurement zone to develop its emissivity characteristics through controlled oxidation during the soldering process or by utilizing the natural metal surface properties, eliminating the need for external coating applications that introduce non-uniformity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables accurate and reliable temperature detection, minimizing adverse effects on electrical properties and allowing for efficient, high-reliability soldering connections with reduced passive intermodulation, particularly suitable for high-frequency applications.
Implementation Method 1
Locally heating the temperature measurement zone to increase its emissivity through oxidation or vaporization of a thin surface layer
Implementation Method 2
Locally heating the temperature measurement zone to increase its emissivity through oxidation or vaporization of a thin surface layer
Implementation Method 3
the heat radiation emitted from at least one temperature measurement zone of one of the components
Data Source
AI summary
A method for producing a soldered connection between at least two components is provided, in which the components are heated for melting a solder in a soldering area. The heating of the soldering area and/or the supply of solder to the soldering area is realized depending on the temperature which is determined by non-contact detection of heat radiation emitted from at least one temperature measurement zone of one of the components. In order to improve the method such that the emissivity of the at least one temperature measurement zone can be increased with high process reliability and with at most a slight adverse effect on the electrical connection between the electrical components, it is proposed that the at least one temperature measurement zone be locally heated for increasing its emissivity. Furthermore, an electrical plug-in connector for producing a soldered connection and use of such a plug-in connector are proposed.