Soldering Apparatus Dynamic Height Control for Rapid Movement
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Solution Overview
Problem
Existing soldering apparatuses face issues with molten solder spilling when jet nozzles move at high speeds, leading to inefficiencies in the soldering process due to the need for slower nozzle movements to prevent spills.
Innovation Solution
A soldering apparatus with a control device that adjusts the acceleration and deceleration of a solder tank to manage the height of molten solder protruding from the jet nozzle, allowing for rapid movement while minimizing spills by controlling the height during XY-direction movements and optimizing positioning with a Z-direction mechanism.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the movement speed of the jet nozzle is increased to improve soldering efficiency, then productivity is improved, but molten solder spills from the jet nozzle
Solution Approach 1:
The patent changes the parameter of solder height dynamically by adjusting the pump drive amount based on the movement state (acceleration, deceleration, constant speed) of the solder tank. This allows the system to maintain optimal solder height during high-speed movement, preventing spill while enabling high productivity.
Solution Approach 2:
The control device monitors the movement state of the solder tank and uses this feedback to adjust the pump drive amount accordingly. This closed-loop control ensures that solder height is maintained within appropriate ranges even during rapid acceleration and deceleration, preventing spill while maximizing movement speed.
2Object-generated harmful factors
If the movement speed of the jet nozzle is decreased to prevent molten solder spill, then solder spill is reduced, but soldering time increases
Solution Approach 1:
Instead of reducing movement speed, the patent changes the solder height parameter dynamically to match the movement conditions. During acceleration and deceleration, the pump drive amount is adjusted to maintain appropriate solder height, allowing high-speed movement without spill. This eliminates the need to slow down, reducing total soldering time.
Solution Approach 2:
The system transitions from a static solder height approach to a dynamic one where solder height is continuously adjusted based on real-time movement conditions. This dynamic adaptation allows the system to operate at maximum speed throughout the process without incurring spill, rather than using slower speeds as a safety margin.
3Productivity
If the acceleration and deceleration of the solder tank are increased to reduce positioning time, then productivity is improved, but molten solder spills occur
Solution Approach 1:
The control device detects the acceleration and deceleration states of the solder tank and uses this feedback to adjust the pump drive amount. During high acceleration or deceleration, the system increases or decreases solder height accordingly, preventing spill even at high positioning speeds. This allows maximum acceleration and deceleration rates to be used throughout the process.
Solution Approach 2:
The patent changes the solder height parameter in response to changes in acceleration and deceleration rates. By dynamically adjusting solder height to match the instantaneous movement conditions, the system prevents spill during rapid positioning while maintaining high productivity.
4Manufacturing precision
If the height of molten solder protruding from the jet nozzle is increased to improve solder application, then soldering quality is improved, but molten solder spills to the outside
Solution Approach 1:
The patent changes the solder height parameter dynamically based on movement conditions rather than maintaining a fixed height. During high-speed movement or acceleration/deceleration, the system reduces solder height to prevent spill. During stable positioning, it increases solder height to ensure proper solder application. This dynamic adjustment resolves the contradiction between soldering quality and spill prevention.
Solution Approach 2:
The system transitions from a static solder height setting to a dynamic one that adapts to real-time movement conditions. This allows the solder height to be optimized for each phase of operation: higher during stable positioning for good solder application, and lower during movement to prevent spill.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables faster nozzle movement speeds while preventing molten solder spills, reducing the time required for soldering and enhancing operational efficiency by precisely controlling the solder height and distance during the soldering process.
Implementation Method 1
a pump, which pumps the molten solder stored in the solder tank to the jet nozzle, and jets the molten solder from the jet nozzle toward the holding surface by the pump being driven
Implementation Method 2
The control device controls the acceleration and deceleration of the solder tank according to the height of the molten solder protruding upwards from a tip of the jet nozzle or the height of the molten solder protruding upwards from the tip of the jet nozzle according to the acceleration and deceleration of the solder tank such that the molten solder does not spill to the outside of the jet nozzle
Data Source
Figure 1
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AI summary
An object of the invention is to provide a soldering apparatus that moves the soldering apparatus at a rapid speed while ensuring that molten solder does not spill to the outside of a jet nozzle. A semiconductor device disclosed in the present description includes a solder tank that stores the molten solder, a jetting mechanism that has the jet nozzle, which extends upwards from the solder tank toward a holding surface, and a pump, which pumps the molten solder stored in the solder tank, and that jets the molten solder from the jet nozzle toward the holding surface by the pump being driven, an XY-direction moving mechanism that moves the solder tank in an X-direction and a Y-direction, which are parallel to the holding surface, and a control device that controls the acceleration and deceleration of the solder tank according to the height of the molten solder protruding upwards from a tip of the jet nozzle or the height of the molten solder protruding upwards from the tip of the jet nozzle according to the acceleration and deceleration of the solder tank such that the molten solder does not spill to the outside of the jet nozzle, when the XY-direction moving mechanism is driven to move the solder tank in the X-direction and/or the Y-direction.