Solderless Interposer Fixture for Bare Chip Dynamic Testing

The patent introduces an intermediary structure (test substrate with contact pads and conductive patterns) that mediates between the bare chip and the testing system. This intermediary allows electrical connections to be established through controlled contact mechanisms (such as spring-loaded contacts or probe cards) rather than direct soldering, thereby maintaining connection reliability while preventing physical damage to the fragile bare chips.

The patent replaces the thermal-mechanical soldering process with a mechanical contact-based connection system. Instead of using heat and molten solder to create permanent bonds, the system uses mechanically actuated contacts (such as spring fingers or flexible probes) that apply controlled pressure to establish electrical connections, eliminating the thermal damage and mechanical stress associated with soldering.

The patent implements preliminary action by pre-configuring test substrates with complete circuitry, contact pads, and mounting structures before the actual testing begins. These substrates are prepared in advance with all necessary electrical connections and mechanical support structures, allowing bare chips to be directly mounted and tested without requiring time-consuming packaging processes. The preliminary preparation of test fixtures enables rapid chip-to-test transitions.

The patent creates universal test substrates that can accommodate multiple different bare chip types and configurations. These multi-functional substrates integrate various test circuits, contact patterns, and mounting structures that can be reused across different testing scenarios, eliminating the need to create custom packages for each chip type and significantly reducing preparation time while maintaining measurement accuracy.