Solid-State Light Emitters With Diamond Thermal Conductivity
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Solution Overview
Problem
Conventional solid-state lighting devices (SSLDs) face challenges with thermal management, as the substrate's low thermal conductivity traps heat, causing the converter material to deteriorate rapidly and reduce color fidelity and efficiency of white light production.
Innovation Solution
The implementation of a carrier substrate with through-substrate conductors that provide both thermal and electrical conductivity, along with a reflective material, to manage heat and maintain the desired color output of SSLDs, enhancing the reliability and lifespan of the devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional substrate (sapphire, silicone carbide, or silicon) is used, then the device structure is simple and easy to manufacture, but the thermal conductivity is low which traps heat and causes converter material deterioration
Solution Approach 1:
The patent employs a composite substrate structure combining sapphire or silicon carbide with a diamond layer. The diamond layer provides superior thermal conductivity to efficiently conduct heat away from the converter material, while the sapphire or silicon carbide base maintains structural integrity and ease of manufacturing. This composite approach resolves the contradiction by integrating materials with complementary properties.
Solution Approach 2:
The patent applies a diamond coating specifically to the region where heat management is most critical - the area in direct contact with or near the converter material. This localized application of high thermal conductivity material addresses the heat trapping problem precisely where it occurs, without requiring the entire substrate to be made of expensive diamond material, thus maintaining manufacturing feasibility.
2Device complexity
If the substrate traps heat due to low thermal conductivity, then the device structure remains simple, but the converter material deteriorates rapidly and color fidelity is reduced
Solution Approach 1:
The composite substrate with diamond layer provides the thermal management necessary to maintain converter material stability and color fidelity, while keeping the overall device structure relatively simple through the use of thin diamond coatings on conventional substrate bases.
Solution Approach 2:
By applying diamond material only in specific regions where heat dissipation is most needed, the patent achieves high color fidelity through effective local heat management without requiring complex device-wide structural changes.
3Reliability
If thermal cooling is implemented at the junction between LED die and substrate, then the reliability and color fidelity improve, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent implements thermal cooling by integrating a diamond layer directly into the substrate structure itself, creating a composite material solution rather than adding separate cooling components. This approach provides effective thermal management while avoiding the complexity of additional cooling systems.
Solution Approach 2:
The patent merges the thermal management function with the substrate structure by incorporating diamond material into the substrate. This combines the mechanical support function of the substrate with the heat dissipation function, eliminating the need for separate cooling structures and reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces heat deterioration of the converter material, maintains color fidelity, and increases the efficiency and lifespan of SSLDs by improving thermal and electrical conductivity between the LED die and the substrate.
Implementation Method 1
The conductive material has a higher thermal conductivity than the carrier substrate and transfers heat away from the solid-state light emitter
Implementation Method 2
The SSLD can further include a reflective material that reflects light
Implementation Method 3
Solid-state lighting devices (SSLDs) use semiconductor light-emitting diodes (LEDs) as sources of illumination
Implementation Method 4
The LED die 4 emits a blue light that stimulates the converter material 6 to emit a light (e.g., a yellow light) at a desired frequency
Data Source
AI summary
Solid-state lighting devices (SSLDs) including a carrier substrate with conductors and methods of manufacturing SSLDs. The conductors can provide (a) improved thermal conductivity between a solid-state light emitter (SSLE) and a package substrate and (b) improved electrical conductivity for the SSLE. In one embodiment, the conductors have higher thermal and electrical conductivities than the carrier substrate supporting the SSLE.