Solid State Lighting Package Angled Walls Thermal Management
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Solution Overview
Problem
Current solid state light packages lack enhanced light output performance, thermal management, and manufacturing ease, necessitating improved designs for solid state illumination applications.
Innovation Solution
A solid state light emission package featuring a body structure with a reflective cavity containing multiple emitters, a heatsink, and electrical leads, where the body structure is formed around a leadframe and heatsink using injection molding, with angled side and end walls to maximize frontal area and provide diffuse output, and apertures in the leads to separate electrical segments and reduce bending forces during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If multiple solid state emitters are mounted in a package, then light output performance and flux density are improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The package is divided into multiple functional zones: a reflective cavity for light direction, a heatsink for thermal management, and separate mounting positions for multiple emitters. This segmentation allows each component to be optimized independently while working together to achieve high light output performance without proportionally increasing overall complexity
Solution Approach 2:
Multiple emitters are integrated into a single package structure that combines the reflective cavity, heatsink, and emitter mounting positions into one unified assembly. This merging approach achieves high flux density and improved lighting performance while managing the complexity through integrated design rather than separate components
2Illumination intensity
If a reflective cavity with angled walls is used, then light output performance and diffuse output are improved, but manufacturing precision requirements increase
Solution Approach 1:
The reflective cavity incorporates angled side and end walls that create a controlled reflective geometry. These angled surfaces are designed to maximize the frontal area and provide diffuse light output while being manufacturable using standard molding techniques, balancing optical performance with manufacturing capability
Solution Approach 2:
The angles of the side and end walls are specifically optimized to achieve the desired diffuse output characteristic. By carefully selecting these geometric parameters, the design achieves improved light distribution while remaining within the capabilities of conventional manufacturing processes
3Ease of manufacture
If apertures are added to electrical leads, then ease of manufacture and bending force reduction are improved, but structural integrity may be compromised
Solution Approach 1:
Apertures are introduced into the electrical leads to create segmented structures. These apertures reduce the bending forces during manufacturing by allowing the lead material to flex more easily, while the remaining material maintains sufficient structural integrity for electrical connection and mechanical support
Solution Approach 2:
The electrical leads incorporate apertures that create a porous-like structure within the solid material. This design allows the leads to be more compliant during assembly operations while maintaining adequate strength through the surrounding material, achieving a balance between ease of manufacture and structural integrity
4Temperature
If a heatsink is integrated into the package, then thermal management is improved, but device complexity and volume increase
Solution Approach 1:
The heatsink is integrated directly into the package structure, merging the thermal management function with the mechanical housing. This integration provides effective heat dissipation for multiple emitters while minimizing the overall package volume compared to separate heatsink assemblies
Solution Approach 2:
The package structure serves multiple functions: it provides mechanical support for the emitters, creates the reflective cavity for light direction, and incorporates the heatsink for thermal management. This multi-functionality reduces the need for separate components, thereby managing volume while achieving effective thermal management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances light output performance, thermal management, and manufacturing efficiency, enabling higher flux density and uniformity while allowing for higher density mounting and improved lighting performance in applications like backlit displays.
Implementation Method 1
a reflective cavity containing multiple emitters, a heatsink, and electrical leads, where the body structure is formed around a leadframe and heatsink using injection molding, with angled side and end walls to maximize frontal area and provide diffuse output
Implementation Method 2
a heatsink, and electrical leads, where the body structure is formed around a leadframe and heatsink
Data Source
Figure 1
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AI summary
A light emission package includes at least one solid state emitter, a leadframe, and a body structure encasing a portion of the leadframe. At least one aperture is defined in an electrical lead to define multiple electrical lead segments, with at least a portion of the aperture disposed outside an exterior side wall of the package. A recess may be defined in the exterior side wall to receive a bent portion of an electrical lead. A body structure cavity may be bounded by a floor, and side wall portions and end wall portions that are separated by transition wall portions including a curved or segmented upper edge, with different wall portions being disposed at different angles of inclination.