Solidification Inhibiting Layer Prevents Sealant Spreading on Display Panel Spacers
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Solution Overview
Problem
The packaging process of display panels often results in low yield due to the sealant diffusing onto spacers, which affects the contact between structural and functional layers, hindering the cell-assembling process and reducing overall panel performance.
Innovation Solution
A display panel design featuring a solidification inhibiting layer between the sealant and spacers, preventing the sealant from spreading and contacting the spacers, thereby maintaining the structural and functional integrity of the layers during encapsulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sealant is applied during packaging process, then encapsulation is achieved, but sealant spreads to spacers affecting layer contact and reducing yield
Solution Approach 1:
A solidification inhibiting layer is introduced as an intermediary between the sealant and spacers. This layer prevents direct contact between the sealant and spacers during the packaging process, thereby maintaining the precision of layer contact while still achieving effective encapsulation. The inhibiting layer acts as a barrier that mediates the interaction between sealant and spacer materials.
Solution Approach 2:
The solidification inhibiting layer is selectively positioned only where needed - specifically between the sealant and spacers - rather than uniformly across the entire structure. This localized application prevents sealant spreading at critical interfaces while maintaining encapsulation effectiveness in other regions, thus resolving the contradiction between encapsulation quality and manufacturing precision.
2Quantity of substance
If sealant spreads to spacers, then encapsulation coverage increases, but electrical connection between layers is hindered
Solution Approach 1:
The solidification inhibiting layer serves as a mediator that allows the sealant to maintain its coverage area while preventing it from compromising the electrical connection. By positioning this layer between the sealant and spacers, the system achieves both adequate sealant coverage and preserved electrical conductivity through the spacer structures.
3Device complexity
If no solidification inhibiting layer is used, then device structure is simpler, but sealant interference with spacers reduces yield
Solution Approach 1:
The packaging structure is segmented into distinct functional layers: the sealant layer for encapsulation, the solidification inhibiting layer for prevention, and the spacer structures for electrical connection. This segmentation allows each component to perform its specific function without interfering with others, thereby maintaining simple overall device architecture while significantly improving manufacturing yield.
Solution Approach 2:
The solidification inhibiting layer is introduced as a thin intermediary component that prevents sealant-spacer interference without substantially increasing device complexity. This single added layer resolves the yield issue caused by sealant spreading while maintaining relatively simple device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the overall performance of the display panel by preventing sealant interference with spacers, increasing yield and ensuring effective electrical connections, leading to improved display effects and reduced power consumption.
Implementation Method 1
the solidification inhibiting layer is configured to inhibit the organic material in contact with the solidification inhibiting layer from being polymerized during solidification
Data Source
AI summary
A display panel and a method of manufacturing the same, a display device are provided. The display panel includes a first substrate and a second substrate disposed oppositely to each other, and a sealant, spacers and a solidification inhibiting layer arranged between the first substrate and the second substrate, the solidification inhibiting layer being provided between the sealant and the spacers, and configured to inhibit the spreading of the sealant to the spacer.