Solution-Processed Metal Contacts for Organic Photovoltaics

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Solution Overview

Problem

Existing methods for forming electrical contacts in organic photovoltaic cells face challenges in achieving high electrical conductivity and stability while allowing for fast, large-area processing at temperatures compatible with underlying layers, which are typically limited by the properties of the substrate and can damage the organic semiconductor layer.

Innovation Solution

A method involving the use of a charge collecting barrier layer, such as PEDOT:PSS, to prevent solvent and particle penetration from a metal nanoparticle ink, followed by a sintering process at temperatures below 150°C to form a highly conductive metal contact layer with electrical conductivity exceeding 10^4 S cm^-1.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If vacuum deposition of metal is used to form electrical contacts, then high electrical conductivity is achieved, but the process is not compatible with large-area solution processing and requires high temperatures

Engineering Contradiction:
Improveelectrical conductivityVSAvoidprocess compatibility with solution processing
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent changes the processing parameters from high-temperature vacuum deposition to low-temperature solution processing followed by sintering. The metal contacts are formed by depositing metal nanoparticles from solution and then sintering at temperatures below 150°C, transforming the process conditions to be compatible with solution-processed organic photovoltaic cells while maintaining high electrical conductivity

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the mechanical vacuum deposition system with a solution-based deposition system. Instead of using vacuum equipment to deposit metal, the patent uses solution processing to deposit metal nanoparticles followed by thermal sintering, substituting a mechanically complex vacuum system with a simpler solution-based approach

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If solution processed conductive polymer materials are used for electrical contacts, then large-area processing is enabled, but electrical conductivity and thermal stability are poor

Engineering Contradiction:
Improvelarge-area processing capabilityVSAvoidelectrical conductivity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent uses composite materials by combining metal nanoparticles with a sintering process. The metal nanoparticle inks contain metal particles dispersed in a solvent with organic ligands, and the sintering process removes the organic components to leave behind a highly conductive metal network, creating a composite material system that achieves high conductivity

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent copies the successful approach of using metal nanoparticle inks from rigid substrate applications and adapts it to flexible organic photovoltaic cells. The same metal nanoparticle deposition and sintering technique used for rigid substrates is copied and applied to flexible substrates, proving that the process is substrate-agnostic and can be universally applied

Inventive Principle:
Principle #26Copying

3Reliability

If high processing temperatures are used to sinter metal contacts, then high electrical conductivity is achieved, but the underlying organic semiconductor layer is damaged

Engineering Contradiction:
Improveelectrical conductivityVSAvoiddamage to organic semiconductor layer
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the sintering temperature parameter from conventional high temperatures (above 150°C) to low temperatures (below 150°C). This parameter change allows the metal contacts to be sintered to high conductivity without exceeding the thermal stability limit of the underlying organic semiconductor layer, thus preventing damage

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent introduces a charge collecting barrier layer as an intermediary between the organic semiconductor layer and the metal contact. This barrier layer, deposited by solution processing, serves as a protective interface that allows the metal contact to be formed without direct thermal contact with the sensitive organic semiconductor layer, mediating the thermal interaction

Inventive Principle:
Principle #24Intermediary (Mediator)

4Adaptability or versatility

If fast evaporation of solvents is used to prevent dissolution of underlying layers, then compatibility with solution processed layers is improved, but processing time and temperature control become more critical

Engineering Contradiction:
Improvecompatibility with underlying layersVSAvoidprocess control requirements
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent introduces a charge collecting barrier layer as an intermediary protective layer between the metal contact and the organic semiconductor layer. This barrier layer, deposited by solution processing, serves as a protective interface that prevents solvent and nanoparticle penetration from the metal contact ink into the underlying organic semiconductor layer, mediating the interaction between incompatible materials

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent performs preliminary action by depositing the charge collecting barrier layer before depositing the metal contact. This preliminary deposition of the barrier layer prepares the interface in advance, preventing potential damage from subsequent metal contact processing steps and ensuring compatibility between the metal contact and underlying organic semiconductor layer

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the formation of electrical contacts with improved conductivity and stability on organic semiconductor layers, suitable for large-area processing, enhancing the power conversion efficiency of organic photovoltaic cells to above 3%, and is compatible with flexible substrates like PEN foils.

Implementation Method 1

the charge collecting barrier layer is substantially impermeable to components of the liquid

Methodology Applied
Scientific EffectPhysical barrier prevention:

Implementation Method 2

performing a sintering process, wherein the charge collecting barrier layer is substantially impermeable to components of the liquid

Methodology Applied
Scientific EffectSintering: Sintering

Data Source

PatentUS8728848B2Solution processing method for forming electrical contacts of organic devices
Publication Date: 2014.05.20 INTERUNIVERSITAIR MICRO ELECTRONICS CENT (IMEC VZW)
  • US8728848B2 patent drawing
  • US8728848B2 patent drawing
  • US8728848B2 patent drawing

AI summary

A method for forming, on an organic semiconductor layer, an electrical contact layer comprising a metal, is disclosed. In one aspect, the method includes providing a charge collecting barrier layer on the organic semiconductor layer, providing a liquid composition comprising a precursor for the metal on the charge collecting barrier layer, and performing a sintering process. The charge collecting barrier layer is substantially impermeable to the components of the liquid composition.