Solvent Blend for Electronics Cleaning
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Solution Overview
Problem
The electronics industry faces challenges with polar solvents like N-methyl-2-pyrrolidone (NMP) due to reproductive toxicity concerns, necessitating the development of eco-friendly alternatives that maintain or improve cleaning and photoresist stripping performance.
Innovation Solution
A solvent blend comprising dimethyl sulfoxide (DMSO) and N-formyl morpholine, along with other components such as N,N-dimethyl propionamide, 3-methoxy-N,N-dimethyl propanamide, N,N-dimethyl acetoacetamide, and N-methyl-ε-caprolactam, which are used for cleaning and stripping surfaces, offering improved environmental profiles and performance comparable to NMP.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If NMP is used for cleaning and stripping, then cleaning ability and stripping ability are maintained, but reproductive toxicity and environmental harm increase
Solution Approach 1:
The patent changes the chemical composition parameters by replacing NMP with a solvent blend consisting of DMSO (10-50 wt%), N-formyl morpholine (10-50 wt%), and at least one amide component (20-80 wt%), thereby maintaining cleaning performance while eliminating reproductive toxicity associated with NMP
Solution Approach 2:
The patent uses a composite solvent system combining multiple components (DMSO, N-formyl morpholine, and amide components) to achieve the desired cleaning and stripping performance without the toxic effects of NMP, leveraging synergistic effects of the blend
2Reliability
If NMP is used for photoresist stripping, then stripping performance is achieved, but environmental regulatory concerns increase
Solution Approach 1:
The patent modifies the solvent composition by formulating a blend with DMSO, N-formyl morpholine, and amide components that provides equivalent photoresist stripping performance while meeting environmental regulations and eliminating NMP-related concerns
3Reliability
If polar solvents like NMP are used, then cleaning effectiveness is maintained, but regulatory restrictions increase
Solution Approach 1:
The patent changes the solvent parameters by replacing NMP with a blend of DMSO, N-formyl morpholine, and amide components, maintaining polarity and cleaning effectiveness while avoiding regulatory restrictions associated with NMP's reproductive toxicity
Solution Approach 2:
The patent extracts and removes NMP from the solvent system, eliminating the harmful substance while retaining the necessary cleaning functionality through the alternative solvent blend
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solvent blend effectively removes contaminants and photoresists from electronic components, demonstrating equivalent or better performance than NMP while reducing toxicological concerns, thus addressing regulatory and environmental issues.
Implementation Method 1
The solvent blend effectively removes contaminants and photoresists from electronic components
Data Source
AI summary
Solvents useful for removing, among other things, photoresists and poly(amic acid)/polyimide from display/semiconductor substrates or electronic processing equipment, consist essentially of: (A) a first component consisting of at least one of dimethyl sulfoxide (DMSO) and N-formyl morpholine, and (B) a second component consisting of at least one of N, N-dimethyl propionamide, 3-methoxy-N, N-dimethyl propanamide, N, N-dimethyl acetoacetamide and N-methyl-ε-caprolactam.