Solventless Epoxy Encapsulating Composition for OLED Moisture Barrier

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Solution Overview

Problem

Organic electronic devices, such as OLEDs, are prone to oxidation and moisture damage from external factors, leading to durability issues and reduced lifespan, necessitating effective moisture and oxygen blocking methods.

Innovation Solution

A solventless encapsulating composition comprising an epoxy compound with a controlled moisture content and volatile organic compounds, combined with a surfactant and photoinitiator, applied via inkjet printing to form a sealing layer that provides excellent moisture barrier properties and adhesion, suitable for top emission type organic electronic devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional encapsulating materials are used to block moisture and oxygen, then durability is improved, but chemical damage and dark spot formation occur due to high moisture content and volatile organic compounds

Engineering Contradiction:
ImprovedurabilityVSAvoidchemical damage and dark spot formation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies parameter changes by strictly controlling the moisture content of the encapsulating composition to 1000 ppm or less (preferably 100 ppm or less) and limiting volatile organic compounds to 100 ppm or less. This parameter control prevents chemical damage and dark spot formation while maintaining effective moisture and oxygen blocking properties for improved durability.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses composite materials by formulating an encapsulating composition that combines an epoxy compound with a curing agent in specific ratios, along with controlled amounts of surfactant and photoinitiator. This composite formulation achieves both protection against environmental factors and prevention of chemical damage to organic electronic elements.

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If solvent-based encapsulating compositions are used for easy application, then ease of manufacture is improved, but moisture barrier properties deteriorate due to high moisture and volatile organic compound content

Engineering Contradiction:
Improveapplication easeVSAvoidmoisture barrier properties
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies the extraction principle by removing organic solvents from the encapsulating composition entirely, creating a solventless formulation. This extraction of harmful solvents maintains ease of application through inkjet printing while significantly improving moisture barrier properties by reducing moisture content to 1000 ppm or less and volatile organic compounds to 100 ppm or less.

Inventive Principle:
Principle #2Taking out (Extraction)

3Ease of operation

If high moisture content encapsulating composition is used to ensure proper curing, then ease of operation is improved, but chemical damage occurs to organic electronic elements

Engineering Contradiction:
Improvecuring processVSAvoidchemical damage
Core Design Contradiction:
Ease of operationVSObject-affected harmful factors

Solution Approach 1:

The patent applies parameter changes by optimizing the moisture content to a precise range (1000 ppm or less, preferably 100 ppm or less) and controlling volatile organic compounds to 100 ppm or less. This parameter optimization ensures proper curing through inkjet application while preventing chemical damage and dark spot formation on organic electronic elements.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The encapsulating composition effectively prevents chemical damage and dark spot formation in organic electronic devices, ensuring extended lifespan and improved durability by blocking moisture and oxygen, while allowing for efficient inkjet application and curing.

Implementation Method 1

combined with a surfactant and photoinitiator, applied via inkjet printing to form a sealing layer

Methodology Applied
Scientific EffectPhotopolymerization: Photopolymerisation

Data Source

PatentUS11041089B2Encapsulating composition
Publication Date: 2021.06.22 LG CHEM LTD
  • US11041089B2 patent drawing

AI summary

The present application relates to an encapsulating composition, a method for preparing the same and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method, can provide a thin display and can control moisture content to prevent damage to the element.